Asustek Computer Inc.

Chun-Chieh Wong

Cheng-Yu Wang

Yao-Jen Chang

Tai-Min Hsu

Chia-Chang Lee

Cheng-yu Wang

A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.

Coating method for liquid metal thermal grease and heat dissipation module

Provided is an electronic device. The electronic device includes a housing, a heat generating element, a plurality of fans, and a guide structure. The housing includes a first outlet. The heat generating element is disposed in the housing. The fans are disposed in the housing. Each fan includes a second outlet. The second outlets at least partially face the interior of the housing. The guide structure is disposed in the housing, and is at least partially located between the fans. The guide structure at least partially extends toward the first outlet.

Electronic device

A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.

Heat dissipation structure

A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.

Heat dissipating device

An electronic device includes an accommodating space, a fan, a cover, and a three dimensional dust extraction mesh. The fan is disposed in the accommodating space. The fan includes a first fixing portion. The cover detachably covers the accommodating space, and the cover includes a second fixing portion in accommodating space. The three dimensional dust extraction mesh includes a body, a third fixing portion, and a fourth fixing portion, and the third fixing portion and the fourth fixing portion are located at periphery of the body. The third fixing portion of the three dimensional dust extraction mesh cooperates with the first fixing portion of the fan, and the fourth fixing portion of the three dimensional dust extraction mesh cooperates with the second fixing portion of the cover to detachably fix the three dimensional dust extraction mesh between the cover and the fan.

A heat dissipating module disposed between a plurality of heating elements is provided. The heat dissipating module includes a plurality of heat conducting units, a set of heat dissipating fins, a plurality of fans, a plurality of sensing units and a control unit. The heat conducting units are connected to the set of the heat dissipating fins and the heating elements. A gap exists between the heat conducting units. The fans are disposed at the same side of the set of the heat dissipating fins. The sensing units are coupled to the heating elements, respectively, to detect the heat generated by the heating elements. The control unit is electrically connected to the fans and the sensing units. The heat generated by the heating elements is different from each other, and the control unit adjusts the speed of the fans according to the heat generated by the heating elements.

Growing community of inventors

Taipei, Taiwan

Chun-Chieh Wong