Mosel Vitelic Corporation

Raynergy Tek Incorporation

Shinera Co., Ltd.

Chun-Chieh Lee

Hua-Jen Tseng

Yi-Ming Chang

Sheng-Feng Hung

Chuang-Yi Liao

Pei-Wei Tsai

Dong-Tay Tsai

Yu-Tang Hsiao

Chia-Hua Li

Gwo-Yuh Yang

Wei-Long Li

Yi-Hua Chin

Nai-Wei Teng

Chia-Hao Lee

Huei-Shuan Tan

Yu-Hua Yeh

Jui-chih Kao

Cheng-Min Pan

Muh-Lang Jang

Hsiuan-ling Ho

Hung-Lin Ke

The present invention relates to a non-fullerene acceptor compound containing benzoselenadiazole, and organic optoelectronic devices comprising the same.

Non-fullerene acceptor compound containing benzoselenadiazole and organic optoelectronic device including the same

An electronic device includes a substrate, a plurality of electronic components and a conductive material. The electronic components are arranged on the substrate, and the electronic components respectively include a lower electrode, a semiconductor layer and an upper electrode, and they are sequentially stacked on the substrate. The electronic components share the semiconductor layer, and the semiconductor layer forms a plurality of connecting channels through the semiconductor layer. The connecting channels are located between the upper electrode of the first electronic component in the electronic components and the lower electrode of the second electronic component in the electronic components. These connecting channels are processed by lasers of different powers. The conductive material is arranged in the connecting channel so that the upper electrode of the first electronic component is electrically connected to the lower electrode of the second electronic component.

Electronic device and manufacturing method of the same

A semiconductor mixed material comprises an electron donor, a first electron acceptor and a second electron acceptor. The first electron donor is a conjugated polymer. The energy gap of the first electron acceptor is less than 1.4 eV. At least one of the molecular stackability, π-π*stackability, and crystallinity of the second electron acceptor is smaller than the first electron acceptor. The electron donor system is configured to be a matrix to blend the first electron acceptor and the second electron acceptor. The present invention also provides an organic electronic device including the semiconductor mixed material.

Semiconductor mixed material and application thereof

One embodiment is directed to a method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality of primary holes and a plurality of primary notches. The method comprises providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter; and trimming the rubber plate using the template as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.

Method for preparing rubber plate used in an ion implanter

A heating lamp bracket for reaction chambers of evaporation coating machines. The heating lamp bracket uses paired and insulation devices to mount heating lamps to a chamber wall of a reaction chamber. The bracket includes a mounting frame that has an insulation outer surface and a mounting outer face opposing to the insulation outer surface. The insulation outer surface has at least one insulation member located thereon for fastening the mounting frame to the chamber wall. The mounting outer surface has at least two independent mounting spots for connecting respectively a connection end of the corresponding heating lamp. The independent mounting spots and non-encased type insulation members of the present invention allows for the replacement of the heating lamps and defective insulation.

Heating lamp brackets for reaction chambers of evaporation coating machines

A chemical mechanical polishing apparatus has a plurality of electric machines for executing mechanical polishing motions, at least two control systems for controlling the mechanical polishing motions, at least two signal wires connected with the two control systems for transmitting signals of the two control systems, and a wave filter comprising two terminals connected with the two signal wires respectively for filtering out the signal whose voltage exceeds a predetermined value in the two signal wires.

Chemical mechanical polishing apparatus with stable signals

A plate-tilting apparatus adapted to be used in a semiconductor-manufacturing process is disclosed. The plate-tilting apparatus is used for preventing thin wafers from being collected in a cassette contacted with each other after the thin wafers are taken out of a solution. It includes a plate having the container locked thereon and having a first edge pivotally connected to a basal plane of a tank used in the semiconductor-manufacturing process, and a plate-lifting device connected to a second edge of the plate opposite to the first edge for lifting the second edge of the plate, so that the plate can be tilted at a specific angle.

Plate-tilting apparatus

A wafer load/unload apparatus used to load/unload the wafer into/from the clamp ring for performing the E-Gun evaporation process is disclosed. The apparatus comprises a base, a central cylinder and a plurality of peripheral cylinders. The base has an even upper surface, and the central cylinder and the plurality of the peripheral cylinders are connected to the upper surface of the base respectively, wherein the plurality of the peripheral cylinders are located around the central cylinders. A recessed trench penetrating through sidewalls of the central cylinder is formed on a top surface of the central cylinder. The central cylinder can penetrate through a clamp ring, wherein the clamp ring is used to load a wafer for performing the E-Gun evaporating process. The spacing distances between the plurality of peripheral cylinders and the central cylinder are bigger than the width of the clamp ring. The plurality of peripheral cylinders are used to prevent the wafer which is placed on the top surface of the central cylinder from falling down.

Wafer load/unload apparatus for E-Gun evaporation process

A structure for connecting fluid channel of fluid delivery system is disclosed. This connecting structure limits the length of the flow-guiding pipe extending into the delivery channel, to reduce particle contaminates and the probability of crack. The present pipe union connecting structure comprises a first pipe, a second pipe mounted to the first pipe, and an inner pipe extending from the first pipe into the second pipe with a certain extending length. The extending length of the inner pipe is less than the proportion of the minimum distance between the inner wall of the second pipe and the outlet of the inner pipe when standstill, to the tangent value of a certain angle &thgr;, which is the maximum inclined angle between the second pipe and the inner pipe.

Connecting structure between fluid channel

A height gauge device for wafer, which is mounted under a cooling water pipe of a back-grinding machine; the device comprises a height gauge box, a measuring rod, a L-shaped linking rod and a resilient member; a signal sensor is mounted inside the height gauge box for measuring the height of a wafer; both ends of the measuring rod are connected with the signal sensor and the L-shaped linking rod respectively; the L-shaped linking rod is mounted with a probing needle; the resilient member is mounted between the L-shaped linking and the cooling water pipe; in height gauging operation, the probing needle on the L-shaped linking needle should be raised first so as to put a wafer under the probing needle, and to have the probing needle pressed against the wafer by means of the resilient force of the resilient member; consequently, the resilient member is subject to elastic fatigue or break; the resilient member of the height gauge device can be replaced directly without opening the height box so as to save time and maintenance cost.

Growing community of inventors

Hsinchu, Taiwan

Chun-Chieh Lee