Au Optronics Corporation

Industrial Technology Research Institute

National Taiwan University

A.u. Vista Inc.

Chun-Cheng Cheng

Chan-Jui Liu

Peng-Bo Xi

Yung-Hui Yeh

Chih-Ming Lai

Wei-Ting Lin

Pin-Miao Liu

Shuo-Yang Sun

Yu-Hsing Liang

Wan-Chen Huang

Seok-Lyul Lee

Fang-Chen Luo

Chen-Chi Lin

Shih-Hsing Hung

Jian-Jang Huang

Ching-Liang Huang

Dean Wang

Liang-Yu Lin

Shih-Hua Hsiao

Kuang-Chung Liu

Hsun-Yi Wang

Chiao-Li Huang

Hsiu-Hua Wang

A display panel includes a drive element, a first heat dissipation layer, a light-emitting element, and a second heat dissipation layer. The drive element is disposed on a substrate. The first heat dissipation layer is disposed on the drive element. The light-emitting element is disposed on the first heat dissipation layer and electrically connected to the drive element. The second heat dissipation layer covers the light-emitting element. A refractive index of the first heat dissipation layer is greater than a refractive index of the second heat dissipation layer when a light-emitting surface of the light-emitting element faces the first heat dissipation layer, and the refractive index of the second heat dissipation layer is greater than the refractive index of the first heat dissipation layer when the light-emitting surface of the light-emitting element faces the second heat dissipation layer.

Display panel

An array substrate includes a substrate as well as a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer and a conductive structure sequentially formed thereon. The first insulating layer has a first opening communicated with a through hole of the substrate. The first conductive layer includes a first ring pattern extending from top of the first insulating layer into the first opening. The second insulating layer has a second opening communicated with the first opening. The second conductive layer includes a second ring pattern extending from top of the second insulating layer into the second opening. The first ring pattern laterally protrudes toward an axis of the through hole from the second ring pattern. The conductive structure extends from above the second insulating layer to a bottom surface of the substrate through the first and second openings and the through hole.

Array substrate

A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.

Display panel and method of fabricating same

A flexible electronic device including a flexible substrate, a plurality of first signal lines, a plurality of first transmission lines, a plurality of first through holes, and a plurality of first conductive structures is provided. The flexible substrate has a first surface and a second surface opposite to the first surface. The first signal lines are located on the first surface and have a first extending direction. The first transmission lines are located on the second surface and have a second extending direction. A first included angle is provided between the first extending direction and the second extending direction. An angle of the first included angle is between 10&#xb0; and 80&#xb0;. The first through holes penetrate through the flexible substrate. The first conductive structures are located in the first through holes and are electrically connected to the first signal lines and the first transmission lines.

Flexible electronic device

A device substrate includes a carrier, a device array, first fan-out lines, and second fan-out lines. The carrier has a first side, a second side, a third side, and a fourth side. The first side is opposite to the second side. The third side is opposite to the fourth side. The device array is disposed on a first surface of the carrier. The device array includes sub-pixels. Each of the sub-pixels includes a switching element and an optoelectronic element electrically connected with the switching element. The first fan-out lines are extending from the first side to the first surface and electrically connected with the device array. The second fan-out lines are extending from the second side to the first surface and electrically connected with the device array. The first fan-out lines and the second fan-out lines are asymmetrically disposed on the first side and the second side, respectively.

Device substrate with asymmetrical fan-out lines and spliced electronic apparatus using the same

A display apparatus, including a substrate, a conductive structure, a pixel unit, a signal line, a transmission line, and a repair structure, is provided. The substrate has a first surface, a second surface, and a through hole. The conductive structure is disposed in the through hole. The pixel unit is disposed on the first surface. The pixel unit includes first, second, third, and fourth connection pads, a driving element, and a light-emitting element. The light-emitting element is electrically connected to the first and second connection pads. The signal line is disposed on the first surface. The driving element is electrically connected to the first and third connection pads through the signal line. The transmission line is disposed on the second surface and electrically connected to the second or fourth connection pad at least through the conductive structure. The repair structure is disposed between the transmission line and the conductive structure.

Display apparatus and manufacturing method thereof

A display apparatus including at least one display panel is provided. The display panel includes a substrate, pad structures, and openings. The substrate has a first and second surface opposite to each other. The pad structures are disposed on the first surface of the substrate. Each pad structure has a connection pad, a conductive pattern layer, and an auxiliary conductive layer electrically connected to each other. The auxiliary conductive layer is overlapped with the conductive pattern layer and the connection pad along a normal direction of the first surface. The openings are disposed on the substrate and penetrate the first and second surfaces of the substrate. The openings and the pad structures are alternately arranged. The substrate also has a third surface defining each opening and connected to the first and second surfaces. The third surface is not conductive. A method of fabricating the display apparatus is also provided.

Display apparatus and method of fabricating the same

A manufacturing method of a display panel includes providing a substrate having a first surface and a second surface opposite to the first surface; forming a high-shielding position layer on the first surface, wherein the light-shielding positioning layer has at least one first alignment pattern; forming a transparent material layer on the second surface; forming a photoresist layer on the transparent material layer; performing an exposure process, such that a light beam passes through the at least one first alignment pattern to penetrate through the substrate and the transparent material layer to the photoresist layer; performing a developing process to pattern the photoresist layer and form a patterned photoresist layer; and performing an etching process to pattern the transparent positioning layer having at least one second alignment pattern. In a direction perpendicular to the substrate, at least one first alignment pattern overlaps with at least one second alignment pattern.

Manufacturing method of display panel

A tiled light emitting diode (LED) display panel includes multiple flexible back plates arranged in tiles. Each flexible back plate has multiple through holes formed thereon. A pixel array is formed by multiple LEDs on the flexible back plates and collectively defines multiple pixels. Each pixel includes one LED and thin-film transistor (TFT) circuits disposed on a first side of a corresponding flexible back plate. A printed circuit board (PCB) is disposed at a second side of the flexible back plates. A third side of the PCB faces the second side of the flexible back plates and has multiple signal lines formed thereon. The LEDs and the TFT circuits of the pixels are electrically connected to the corresponding signal lines via multiple conductive structures formed in the through holes. A resistance per unit length of each flexible back plates is greater than a resistance per unit length of the PCB.

Tiled light emitting diode display panel having different resistance per unit length signal lines

A semiconductor substrate includes a substrate, a first metal oxide semiconductor layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, and a second metal oxide semiconductor layer. The first transistor includes a first metal oxide semiconductor pattern of the first metal oxide semiconductor layer, a first gate of the first conductive layer, a first source of the second conductive layer, and a first drain of the second conductive layer. The second transistor includes a second metal oxide semiconductor pattern of the first metal oxide semiconductor layer, a second gate of the first conductive layer, a second source of the second conductive layer, a second drain of the second conductive layer, and a third metal oxide semiconductor pattern of the second metal oxide semiconductor layer.

Semiconductor substrate

A display panel is provided. The display panel includes a substrate, a light-shielding positioning layer and a transparent positioning layer. The substrate has a first surface and a second surface opposite to the first surface. The light-shielding positioning layer is disposed on the first layer and has at least one first alignment pattern. The transparent positioning layer is disposed on the second layer and has at least one second alignment pattern. In a direction perpendicular to the substrate, the at least one first alignment pattern overlaps with the at least one second alignment pattern. A manufacturing method of the display panel is also provided.

Display panel and manufacturing method thereof

A thin film transistor includes a gate electrode, a semiconductor layer, a gate dielectric layer, a first dielectric layer, a source electrode, and a drain electrode. The gate electrode is disposed on a substrate. The semiconductor layer is disposed on the substrate and overlaps with the gate electrode. The gate dielectric layer is disposed between the gate electrode and the semiconductor layer. The first dielectric layer is disposed on the substrate and covers two sides of the gate electrode or the semiconductor layer. The dielectric constant of the first dielectric layer is less than the dielectric constant of the gate dielectric layer, and the dielectric constant of the first dielectric layer is less than 4. The source electrode and the drain electrode are disposed on the substrate. The source electrode is separated from the drain electrode, and the source electrode and the drain electrode separately contact the semiconductor layer.

Thin film transistor and photoelectric device thereof

A thin-film transistor comprises a substrate, a first electrode on the top surface of the substrate, an insulation layer on the top surface of the substrate and covering the first electrode, a semiconductor oxide layer on the top surface of the insulation layer, a protection layer on the top surface of the semiconductor oxide layer, an organic dielectric layer on the top surface of the semiconductor oxide layer and covering the protection layer, a source electrode and a drain electrode both penetrating the organic dielectric layer from the top surface thereof. A channel thickness of the semiconductor oxide layer is not thicker than 20 nanometers. The source electrode contacts the semiconductor oxide layer at the first side of the protection layer and the drain electrode contacts the semiconductor oxide layer at the second side, opposite to the first side, of the protection layer.

Thin-film transistor and method for forming the same

A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.

Method of bonding and debonding substrate

Methods of fabricating active device array and organic light emitting diode array are provided. A first pattern metal layer is formed over a substrate. An oxide semiconductor layer is formed entirely over the substrate. A first insulation layer covering the first patterned metal layer and the oxide semiconductor layer is formed entirely on the substrate. A second patterned metal layer is formed on the first insulation layer. The oxide semiconductor layer and the first insulation layer is patterned by using the second patterned metal layer as a mask to form a first patterned oxide semiconductor layer and a first patterned insulation layer. A second insulation layer is entirely formed on the substrate. A second patterned oxide semiconductor layer is formed over the second insulation layer. A third patterned metal layer is formed over the second insulation layer.

Growing community of inventors

Hsinchu, Taiwan

Chun-Cheng Cheng