Chi Mei Corporation

Chun-An Shih

Ming-Ju Wu

Kai-Min Chen

Wei-Jie Huang

Hao-Wei Liao

Ching-Yuan Tseng

Chun-Hsien Lee

Chi-Ming Liu

Chih-Hang Hsu

The invention shows a photosensitive resin composition which can be used in protective film and liquid crystal display element and provides good transparency and high chemical resistance. The composition includes a complex resin (A), an o-naphthoquinone diazide sulfonate (B), and a solvent (C). The complex resin (A) includes a main chain and a side chain. The main chain includes a repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The side chain includes a repeating unit derived from siloxane based monomer (a2), and is bonded to the repeating unit derived from siloxane (meth)acrylate based monomer (a1-2). The complex resin (A) satisfies at least one of the following conditions (I) and (II):

Photosensitive resin composition, protective film, and liquid crystal display element

The invention relates to a photosensitive polysiloxane composition and a thin film formed by the aforementioned photosensitive polysiloxane composition. The thin film is a planarization film of a TFT substrate, an interlayer insulating film or an overcoat of a core material or a protective material in a waveguide. The invention is to provide a photosensitive polysiloxane composition having excellent surface flatness and high tapered angle of a pattern. The photosensitive polysiloxane composition comprises a polysiloxane (A), an o-naphthoquinone diazide sulfonic acid ester (B), an alkali-soluble resin containing a silyl group (C) and a solvent (D).

Photosensitive polysiloxane composition and uses thereof

The present invention relates to a photosensitive resin composition, a protective film and an element having the same. The aforementioned photosensitive resin composition includes a polysiloxane resin (A), an alkali-soluble resin (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The alkali-soluble resin (B) is copolymerized by an unsaturated carboxylic acid or unsaturated carboxylic anhydride compound (b1), a fluorene derivative having a double-bond group (b2) and an unsaturated compound having an acid-decomposable group (b3).

Photosensitive resin composition, protective film and element having the same

A photosensitive composition, a protective film, and an element having the protective film are provided. The photosensitive composition includes a polysiloxane (A), an o-naphthoquinonediazidesulfonate (B), and a solvent (C). The polysiloxane (A) is obtained by polycondensing a mixture, wherein the mixture includes a silane monomer (a-1) represented by formula (1), a silane monomer (a-2) represented by formula (2), and a silicon-containing compound (a-3). The silicon-containing compound (a-3) is selected from the group consisting of a silane monomer represented by formula (3), a siloxane prepolymer, and a silica particle. The photosensitive composition can be made into a protective film with excellent chemical resistance.(RO)Si&#x2014;R&#x2014;Si(OR)&#x2003;&#x2003;formula (1)Si(R)(OR)&#x2003;&#x2003;formula (2)Si(R)(OR)&#x2003;&#x2003;formula (3)

Photosensitive composition, protective film, and element having the protective film

A positive photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.

Positive photosensitive resin composition and pattern forming method

The present invention relates to a photosensitive resin composition, a protective film and an element having the same. The aforementioned photosensitive resin composition includes an alkali-soluble resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B) and a solvent (C). The alkali-soluble resin (A) is copolymerized by an unsaturated carboxylic acid or unsaturated carboxylic anhydride compound (a1), a fluorene derivative having a double-bond group (a2) and an unsaturated compound having an acid-decomposable group (a3).

The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.

Positive photosensitive resin composition and method for forming pattern by using the same

A photosensitive polysiloxane composition, a protecting film and an element having the protecting film are provided. The photosensitive polysiloxane composition includes a polysiloxane (A), an o-naphthoquinonediazidesulfonate (B), a silane compound (C) containing an amic acid group and a solvent (D). When the photosensitive polysiloxane composition is used for forming a protecting film, the protecting film shows favorable cross-section shape and heat resistance.

Photosensitive polysiloxane composition, protecting film and element having the protecting film

The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. The positive photosensitive resin composition includes a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a dye (C) and a solvent (D). The novolac resin (A) further includes hydroxy-type novolac resin (A-1), which is synthesized by condensing hydroxylbenzaldehyde compound with aromatic hydroxyl compound. The dye (C) includes at least one (C-1) selected from the group consisting of diazo dye, anthraquinone dye and chromium (III, Cr) azo dye, as well as triarylmethane dye (C-2). Since the positive photosensitive resin composition can form colorfully fine patterns on metal circuits, and such patterns are not decolored after being etched, thereby beneficially blocking the reflected light of the metal circuits.

Positive photosensitive resin composition and method for forming patterns by using the same

The invention relates to a positive photosensitive resin composition without color off after etching. The invention also provides a method for manufacturing a thin-film transistor array substrate, a thin-film transistor array substrate and a liquid crystal display device.

Positive photosensitive resin composition and uses thereof

Disclosed is a photosensitive polysiloxane composition including: 

Photo-curing polysiloxane composition and application thereof

A photosensitive resin composition includes (A) an alkali-soluble resin, (B) a polysiloxane, (C) an ethylenically unsaturated compound, (D) a photo-initiator, (E) a first solvent, and (F) a black pigment dispersion. The alkali-soluble resin (A) includes an unsaturated-group-containing resin (A-1) obtained by subjecting a mixture containing (i) an epoxy compound having at least two epoxy groups and (ii) a compound having at least one carboxyl group and at least one ethylenically unsaturated group to polymerization. A weight ratio of the black pigment dispersion (F) to the polysiloxane (B) ranges from 5 to 35. Application of the photosensitive resin composition is also disclosed.

Photosensitive resin composition and application of the same

A photosensitive resin composition includes (A) an alkali-soluble resin, (B) a polysiloxane, (C) an ethylenically unsaturated compound, (D) a photo-initiator, (E) a black pigment, and (F) a solvent. The alkali-soluble resin includes an unsaturated-group-containing resin obtained by subjecting a mixture containing (i) an epoxy compound having at least two epoxy groups and (ii) a compound having at least one carboxyl group and at least one ethylenically unsaturated group to polymerization. A weight ratio of the unsaturated-group-containing resin to the polysiloxane ranges from 0.1 to 3.0. Application of the photosensitive resin composition is also disclosed.

A photosensitive resin composition includes: an alkali-soluble resin; an o-naphthoquinonediazidesulfonic acid ester; a urethane(meth)acrylate compound having at least six (meth)acryloyl groups in a molecule; and a solvent. A protective film which is formed from the photosensitive resin composition and an element which includes the protective film are also provided.

Photosensitive resin composition and applications thereof

The invention relates to a photosensitive polysiloxane composition that has good thermal transmittance, good chemical resistance and good sensitivity and good refractivity. The invention also provides a method for forming a thin film on a substrate, a thin film on a substrate and an apparatus.

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Tainan, Taiwan

Chun-An Shih