Industrial Technology Research Institute

National Central University

Chun-An Lu

Hong-Ching Lin

Jiun-Jang Yu

Chiung-Hsiung Chen

Yuan-Ling Tsai

Chyi-Ming Leu

Chun-Wei Su

Kuo-Chan Chiou

Wei-Yu Li

Wei Chung

Joseph Wang

Yu-Ju Kuo

Ying-Jung Chiang

Szu-Po Huang

Shaw-Jye Wu

Lian-Chin Wang

Shin-Jye Wu

Ching-Hui Yeh

An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.

Electromagnetic wave guidance and beam reshaping structure

A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.

Capacitor with multiple dielectric layers having dielectric powder and polyimide

An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.

Antenna array module and manufacturing method thereof

A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.

Dielectric ceramic composition

A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern' where the only change is the addition of wires.

Flexible substrate embedded with wires and method for fabricating the same

A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.

Radio frequency identification tag and diaper, absorber and sensing system using the same

A method for providing thermotolerance of a plant and the genetic engineering applications thereof are disclosed. DNA fragment containing a gene encoding EXPORTIN1A is transferred into a plant cell to provide or enhance thermotolerance of the plant. The method can be applied in genetic engineering to select transgenic plant.

Method for enhancing thermotolerance of plant relating to exportin1A and genetic engineering applications thereof

A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.

Method for forming nanometer scale dot-shaped materials

An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10&#xd7;10&#x3a9;&#xb7;cm.

Growing community of inventors

Taipei, Taiwan

Chun-An Lu