Other

Motorola Corporation

Freescale Semiconductor,inc.

Skyworks Solutions, Inc.

Powerwave Technologies, Inc.

Skyworks Soultions, Inc.

Chuming Shih

Jong-Hoon Lee

Guillaume Alexandre Blin

Nuttapong Srirattana

Hanching Fuh

Fikret Altunkilic

Anuj Madan

Ahmad Khanifar

Nikolai Maslennikov

Steven Christopher Sprinkle

Haki Cebi

Richard Emil Sweeney

Mengshu Hsu

Radio-frequency (RF) switch circuits are disclosed providing improved switching performance. An RF switch system includes a plurality of field-effect transistors (FETs) connected in series between first and second nodes, each FET having a gate and a body. A compensation network including a gate-coupling circuit couples the gates of each pair of neighboring FETs. The compensation network may further including a body-coupling circuit that couples the bodies of each pair of neighboring FETs.

Circuits, devices, methods and applications related to silicon-on-insulator based radio-frequency switches

Methods for antenna switch modules are disclosed. In certain implementations, a method of making an antenna switch module is provided. The method includes providing a package substrate implemented to receive one or more electrical components, attaching a silicon on insulator (SOI) die to the package substrate, and providing an integrated filter. The SOI die includes a capacitor and a switch coupled to a plurality of radio frequency (RF) signal paths. The integrated filter filters an RF signal received on a first RF signal path of the plurality of RF signal paths, and includes the capacitor of the SOI die and an inductor.

Methods for antenna switch modules

Antenna switch modules and methods of making the same are provided. In certain implementations, an antenna switch module includes a package substrate, an integrated filter, and a silicon on insulator (SOI) die attached to the package substrate. The SOI die includes a capacitor configured to operate in the integrated filter and a multi throw switch for selecting amongst the RF signal paths. In some implementations, a surface mount inductor is attached to the package substrate adjacent the SOI die and is configured to operate in the integrated filter with the capacitor. In certain implementations, the inductor is formed from a conductive layer of the package substrate disposed beneath a layer of the package substrate used to attach the SOI die.

Antenna switch modules and methods of making the same

A radio frequency power amplifier has first and second amplifier transistors. The first and second amplifier transistors have a common element thereof electrically interconnected with a common bus. A forked conductor having two legs thereof electrically connected to the common bus, each leg having a distal end proximate one of the first and second amplifier transistors. The common bus and the forked conductor are generally symmetric about an axis about which the first and second amplifier transistors are symmetrically disposed.

Balanced radio frequency power amplifier with temperature compensation

An active bias circuit connected to a power amplifier PA maintains a power amplifier DC quiescent current at a fixed value over a wide temperature range. The active bias circuit includes first and second current mirror circuits . The power amplifier PA is an element of the second current mirror circuit . A temperature compensation circuit is connected to the first current mirror circuit for providing temperature compensation therewith. A first reference voltage source is connected to the first current mirror circuit by way of the temperature compensation circuit for providing a first reference voltage Vref to the first current mirror circuit . A current sink is connected to a transistor of the first current mirror circuit and a voltage source adjustment circuit is connected to the first current mirror circuit for setting a voltage provided to the first current mirror circuit

Active bias circuit

Growing community of inventors

Chandler, AZ, United States of America

Chuming Shih