Samsung Electronics Co., Ltd.

Korea University Research and Business Foundation

Korea University Industrial Academic Collaboration Foundation

Semes Co., Ltd.

Skhynix Inc.

Sk Telecom Company, Ltd.

The Hong Kong University of Science and Technology

Korean University Industry & Academy Cooperation Foundation

Chulwoo Kim

Yun Seok Choi

Hyunsu Park

Yanggyoo Jung

Hyo-Chang Ryu

Daewoo Son

Jonghyuck Choi

Sanghyun Lee

Yeonho Lee

Kyoungho Kim

Soonsung Ahn

Juhyun Lyu

Beomjeong Oh

Jin-Cheol Sim

Jincheol Sim

Heejin Kim

Junghwan Choi

Jongho Lee

Hyun-Woo Lee

Younghak Oh

Tae-Jin Kim

In-Ho Lee

Min-Cheol Hong

Sejin Park

Kyoungsei Choi

Unbyoung Kang

Eunseok Song

Jungmoon Kim

Kwok Tai Philip Mok

Ki-hong Kim

Sung Hwa Ok

Yechung Chung

Kwanyeob Chae

Ochae Kwon

Myoungwoo Nam

Inseong Hwang

Young-Ho Kwak

Jihwan Hyun

Seok-Soo Yoon

Ilgeun Bok

Seungwoo Park

Kyeongkeun Kang

Young Hwan Chang

Joongsam Yun

Junyoung Song

Seung-Woo Park

Jin Cheol Sim

Jae Suk Yu

Gilwon Yoon

Soohyun Nam

Hyun Woo Cho

Jong-Hyuck Choi

Hyo-chang Ryu

Yoonjae Choi

Yoon-Jae Choi

Yeonsu Jung

Yeonchul Song

Kil Hoon Lee

Myeongjun Lim

Changhwan Park

Jiyoon Kim

Sooho Park

Gyoochul Lee

Chaekang Lim

Hyeonseop Lee

Minseop Lee

Seungah Oh

Young-Hyun Baek

Jun-Young Song

Yo Han Choi

Chae Kang Lim

Inhwa Jung

Song Minyoung

Ahn Sunghoon

Kyoung-Seok In

Janghoon Song

Sangdon Jung

Minyoung Song

Sunghoon Ahn

Sanghwa Lee

Ja Bum Koo

Iigeun Bok

A mold includes a core in which a molded product is formed, the core comprises a cored body and a sliding core on the core body, separable from the core body in a first direction with respect to the core body, and an ejector to press the sliding core in the first direction to separate the molded product formed in the core from the core. The ejector includes a driver positioned below the core and movable toward a lower surface of the core in the first direction or away from the lower surface of the core in a direction opposite to the first direction, and a rod movable in the first direction to press the sliding core to be separated from the driver or movable in the direction opposite to the first direction to couple the sliding core with the driver, and the rod is movable further in the first direction than the driver.

Mold

A semiconductor device is provided. The semiconductor device includes: an equalizer circuit configured to output a first control signal corresponding to a first bit of original two-bit data and a second control signal corresponding to a second bit of the original two-bit data; and a driver circuit including a plurality of pull-up transistors connected between an output node and a first power node configured to provide a first power supply voltage, and a plurality of pull-down transistors connected between the output node and a second power node configured to provide a second power supply voltage, wherein the second power supply voltage is lower than the first power supply voltage, and the driver circuit is connected to the equalizer circuit in series. The plurality of pull-up transistors includes a first pull-up transistor and a second pull-up transistor connected to each other in parallel, between the first power node and the output node, and a third pull-up transistor and a fourth pull-up transistor connected to each other in series, between the first power node and the output node.

Semiconductor device

In analog-to-digital conversion, a plurality of stages configured in a sequence to sequentially decide a plurality of bits in successive-approximation, each of the plurality of stages configured to operate in response to a corresponding clock among a plurality of clocks, and decide a corresponding bit among the plurality of bits from a corresponding positive pulse among a plurality of positive pulses and a corresponding negative pulse among a plurality of negative pulses; and a plurality of clock generating circuits respectively corresponding to a plurality of first stages among the plurality of stages, each of the plurality of clock generating circuit configured to generate the corresponding clock of a corresponding stage among the plurality of first stages based on an operation of a previous stage among the plurality of stages, the previous stage being before the corresponding stage in the sequence.

Time domain analog-to-digital converter and analog-to-digital converting method

A semiconductor package may include a package substrate, a first interposer substrate mounted on the package substrate, and a first semiconductor chip disposed on the first interposer substrate. The first interposer substrate may include a first base layer, a second base layer disposed on the first base layer, circuit patterns provided in each of the first base layer and the second base layer, and an integrated device embedded in the first base layer and connected to at least one of the circuit patterns. A top surface of the first base layer may contact a bottom surface of the second base layer.

Method of fabricating semiconductor package including sub-interposer substrates

A semiconductor device includes a multilevel receiver including a signal determiner receiving a plurality of multilevel signals and outputting a result of mutual comparison of the plurality of multilevel signals as an N-bit signal, where N is a natural number equal to or greater than 2. A decoder restores a valid signal among the N-bit signals from the signal determiner to an M-bit data signal, where M is a natural number less than N. A clock generator receives a reference clock signal, generates an input clock signal using the reference clock signal, inputs the input clock signal to the signal determiner, and determines a phase of the input clock signal based on an occurrence probability of an invalid signal not restored to the M-bit data signal among the N-bit signals.

Semiconductor device and memory system

Disclosed in a PAM-4 receiver using pattern-based clock and data recovery circuitry, which includes an analog front end that receives an external signal and recovers channel loss to output a refined PAM-4 signal, a comparison unit that receives the PAM-4 signal and compares the PAM-4 signal with a reference voltage to generate a recovery signal, and a recovery unit that receives the recovery signal and recovers data and a clock. The analog front end includes an equalizer that matches amplitudes of all frequency components of the external signal and an amplifier that amplifies an output signal of the equalizer.

PAM-4 receiver using pattern-based clock and data recovery circuitry

A semiconductor package includes a package substrate, an interposer on the package substrate, semiconductor devices in individual mounting regions on a first surface of the interposer, respectively, first conductive connection members, and a molding member on the interposer. The interposer has first bonding pads in the individual mounting regions, respectively. The semiconductor devices each have chip pads electrically connected to the first bonding pads. The first conductive connection members are between the first bonding pads and the chip pads. The molding member covers the semiconductor devices and fills gaps between the first surface of the interposer and the semiconductor devices. At least one of the individual mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, and the first bonding pads are in the pad regions.

Semiconductor package and method of manufacturing semiconductor package

A semiconductor package includes a substrate including a wiring, a semiconductor chip structure on the substrate, and electrically connected to the wiring, an underfill resin in a space between the substrate and the semiconductor chip structure, and a stiffener surrounding the semiconductor chip structure, on the substrate, wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.

Semiconductor packages

A single-signal receiver including an active inductor continuous time linear equalizer and a reference voltage selection equalizer is provided. The single-signal receiver includes a continuous time linear equalizing unit to receive a single signal, and compensate for distortion of the single signal to generate an output, and a reference voltage selection equalizing unit to select one of a first reference voltage value and a second reference voltage value based on a previous output from a comparator, and sample the output from the continuous time linear equalizing unit, based on the one of the first reference voltage value and the second reference voltage value.

Single-signal receiver including active inductor continuous time linear equalizer and reference voltage selection equalizer, and method for operating the same

A transmitter and a receiver are provided. The transmitter includes a processing unit configured to receive a clock signal and a data signal, set a value of a consecutive identical digit (CID) value related to the data signal and generate a modulation signal during a unit interval (UI) based on the data signal and the CID value, and a transmitter driver configured to output output signals having different voltage levels during the unit interval by receiving the modulation signal.

Data transmitting and receiving device

An apparatus for dispensing droplet may include a droplet discharging member, a stage and a control member. The droplet discharging member may include a plurality of nozzles arranged in a first direction by a constant interval. The stage may receive a substrate including a plurality of regions for forming a plurality of pixels of a same size disposed in the first direction and a second direction substantially perpendicular to the first direction. The control member may control the droplet discharging member such that amounts of droplets may be substantially identical in the regions of the substrate for the pixels if the numbers of the nozzles of the droplet discharging member with respect to sides of the regions of the substrate for the pixels are different in the first direction. The control member may identify patterns of discharged droplets in the regions of the substrate for the pixels and adjusts the amounts of the droplets form the nozzles of the droplet discharging member by controlling operation of each of nozzles of the droplet discharging member.

Apparatus for dispensing droplet and method for dispensing droplet

Disclosed is an electronic device, which includes a plurality of driving coils that are sequentially arranged in a first direction in a plan view, a plurality of sensing electrodes that are spaced and insulated from the plurality of driving coils and are sequentially arranged in a second direction orthogonal or pseudo-orthogonal to the first direction in a plan view, and a processor that is electrically connected with the plurality of driving coils and the plurality of sensing electrodes. At least one of the plurality of sensing electrodes is electrically coupled with a stylus excited by a magnetic field generated by the plurality of driving coils. The processor applies a driving signal to the plurality of driving coils, receives a response signal to the driving signal from the plurality of sensing electrodes, and identifies a contact location of the stylus based on the response signal.

Electronic device including capacitive sensor driven by stylus excited by magnetic field, touch system including the same, and operating method thereof

Disclosed is electronic device for identifying touch position, touch system including electronic device, and operation method thereof.

Electronic device for identifying touch position, touch system including electronic device, and operation method thereof

Semiconductor package and method of fabricating the same

Growing community of inventors

Seoul, South Korea

Chulwoo Kim