Samsung Electronics Co., Ltd.

Chulsung Park

Kwangil Park

Jaehyung Lee

JungSik Kim

Youngdae Lee

Sungmin Yim

Duyeul Kim

Taeyoung Oh

Suyeon Doo

Namjong Kim

Kijong Park

Eunsung Seo

Heejin Lee

Seok-hong Kwon

Hyoungjoon Kim

A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

Semiconductor device having interconnection in package and method for manufacturing the same

A semiconductor memory device includes a memory circuit including a plurality of memory cells and a refresh control circuit. The refresh control circuit is configured to determine a number of times to perform a target row refresh (TRR) in response to a mode register set (MRS) code signal, wherein the MRS code signal is generated in response to a temperature change, and the refresh control circuit is configured to maintain a refresh cycle of at least two of the memory cells for a period of time when the refresh cycle is changed due to the temperature change.

Semiconductor memory device that includes a refresh control circuit that maintains a refresh cycle when an MRS code signal is changed due to temperature

A semiconductor package includes a logic chip mounted on a substrate, a first memory chip disposed on the logic chip, which includes a first active surface, and a second memory chip disposed on the first memory chip. The second memory chip is disposed on the first memory chip in such a way that the first memory chip and second memory chip are offset from each other. The second memory chip has a second active surface. The first active surface and the second active surface face each other and are electrically connected to each other through a first solder bump.

Semiconductor package

Semiconductor memory device that performs a refresh operation

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Seoul, South Korea

Chulsung Park