Samsung Electronics Co., Ltd.

Chul-woong Jang

Jae-il Lee

Woon-sup Choi

Sung-Yeol Kim

In-ho Choi

Ho-sun Yoo

In-su Yang

Seung-ho Jang

Young-ki Kwak

Young-jin Lee

Jong-pil Park

Jong-pill Park

Jeong-Gon Lee

Min-sung Kim

Seung-jun Chee

A signal capture system for capturing a signal and storing the captured signal in a storage apparatus in real time, and a test apparatus including the signal capture system. The signal capture system includes a printed circuit board; a socket that is connected to the printed circuit board and on which a reference memory component is mounted; and an interposer that is mounted on the printed circuit board, is connected to the socket, an external apparatus, and a storage apparatus, receives first signals from the reference memory component and transmits the received first signals to the external apparatus and the storage apparatus, and receives second signals from the external apparatus and transmits the received second signals to the reference memory component and the storage apparatus, wherein a shape of the socket is defined according to a type of the reference memory component.

Signal capture system and test apparatus including the same

A field mounting-type test apparatus and method for enhancing competitiveness of a product by simulating various test conditions including a mounting environment for improving quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment thus reducing testing time and cost. The field mounting-type test apparatus includes a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT using the logic data.

Field mounting-type test apparatus and method for testing memory component or module in actual PC environment

An apparatus for testing an object includes a test chamber, a guiding member, testing units and a transferring unit. The test chamber is configured to receive the object. The guiding member is arranged extending along a first direction in the test chamber. The testing units are movably connected to the guiding member to test electrical characteristics of the object. The transferring unit is arranged in the test chamber to load the object into one of the testing units and unload the object from one of the testing units. The testing units may be transferred to a position for repair without suspension of the apparatus. The object may be tested using another testing unit while the other testing unit is being repaired.

Apparatus for testing a semiconductor package

Automatic test equipment is capable of performing a high-speed test of semiconductor devices, with a low cost and high efficiency. The automatic test equipment (ATE) comprises: an ATE body configured to electrically test semiconductor devices; a field programmable gate array (FPGA) controlling drivers and comparators on the ATE; an accelerator connected to an output terminal of the FPGA and that doubles an operating frequency of the FPGA; and a decelerator connected to an output terminal of the FPGA and that converts an operating frequency of data transferred from the semiconductor device to the operating frequency of the FPGA.

Automatic test equipment capable of high speed test

Growing community of inventors

Cheonan-si, South Korea

Chul-woong Jang