Amkor Technology, Inc.

Lsis Co., Ltd.

Id Quantique Sa

Wooriro Co., Ltd.

Chul Woo Park

Choon Heung Lee

Sang Jae Jang

Sung Su Park

Suk Gu Ko

Sang Ho Lee

Jae Dong Kim

Jun Young Yang

Woo Sup Kim

Curtis Michael Zwenger

Chan Yong Park

Dae Byoung Kang

Chang Deok Lee

Seok Beom Cho

Hong Tae Park

Soo Hyun Baek

Jong Woon Choi

Raul M Guerrero

A photon detection device having a high light detection efficiency. The photon detection device includes a first light reception part which receives a gate signal and outputs a first signal; a second light reception part which receives a gate signal and outputs a second signal; and a determination part which determines whether or not a photon is received, on the basis of the first signal from the first light reception part and the second signal from the second light reception part. The photon is incident on the first light reception part among the first light reception part and the second light reception part, and the breakdown voltage of the second light reception part is higher than the breakdown voltage of the first light reception part.

Detection of photon by pairing avalanche photodiodes with different threshold voltages

A low voltage DC/DC converter (LDC) control apparatus for controlling an LDC including a transformer and a PWM controller is provided. The low voltage DC/DC converter (LDC) control apparatus includes an input current calculating unit calculating an input current of the LDC by using magnetization inductance information on the transformer and effective duty information on the PWM controller; an output current calculating unit calculating the instantaneous value and average value of an output current based on the input current calculated by the input current calculating unit; and an LDC control unit generating a control signal for over current protection (OCP) or power limit based on the instantaneous value and average value of the output current calculated by the output current calculating unit, wherein the LDC control unit outputs the generated control signal to the PWM controller.

Apparatus and method for controlling low voltage DC/DC converter by using input current information on low voltage DC/DC converter

A driving device of a synchronous rectification apparatus is provided. The driving device includes a voltage detection part disposed on a power input terminal to detect a voltage value of a power inputted through the power input terminal, an adjustment part receiving the voltage value detected through the voltage detection part, the adjustment part adjusting the receive voltage value to output the adjusted voltage value, and a comparison part receiving the voltage value adjusted through the adjustment part into a positive terminal and a synchronous rectification starting value into a negative terminal, the comparison part outputting an command value of the synchronous rectification apparatus, which is obtained by comparing the received voltage value with the synchronous rectification starting value.

Driving device of synchronous rectification apparatus

In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. The module is inserted into a complementary cavity formed within a case of the memory card, such case generally defining the outer appearance of the memory card. The module is secured within the cavity of the case through the use of an adhesive. In each embodiment of the present invention, the module is uniquely configured to prevent adhesive leakage from within the corresponding cavity of the case of the memory card when the module is secured within the cavity.

Modular memory card and method of making same

A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, multiple side edges, a chamfer extending between a pair of the side edges, a plurality of pads disposed on the lower circuit board surface, and a conductive pattern which is disposed on the upper circuit board surface and electrically connected to the pads. At least one electronic circuit device is attached to the upper circuit board surface and electrically connected to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board and the electronic circuit element such that sections of the upper circuit board surface, including one which extends along the entirety of the chamfer, is not covered by the body.

Chamfered memory card module and method of making same

A memory card comprising a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof. Mounted to the top surface of the substrate is at least one component which is itself electrically connected to the terminals of the substrate. Formed on the bottom surface of the substrate is a first encapsulation part. Formed on the top surface of the substrate is a second encapsulation part which encapsulates the component mounted thereto.

Double mold memory card and its manufacturing method

In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a case which is cooperatively engaged to a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. In each embodiment of the present invention, the case is reinforced by a stiffener which effectively increases the mechanical strength of the fully fabricated memory card, thus providing the capability to withstand typical bending and twisting tests. The stiffener may be provided in any one of a plurality of different shapes or profiles, and may embedded within one or more of various locations within the case.

Enhanced durability memory card

A memory card including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad and at least one test pad disposed thereon. The module is inserted into a complementary cavity formed within a case of the memory card, such case generally defining the outer appearance of the memory card. The module is secured within the cavity of the case through the use of an adhesive. In each embodiment of the present invention, first and second covers are movably attached to a case for selectively covering or exposing the I/O pads and the test features/pads of the module of the memory card.

Multiple cover memory card

A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, at least one test pad disposed on the upper circuit board surface, and a conductive pattern disposed on the lower circuit board surface and electrically connected to the test pad. Electrically connected to the conductive pattern of the circuit board is a leadframe which includes a plurality of leads, each of the leads having a signal pad portion. At least one electronic circuit element is attached to the lower circuit board surface and electrically connected to the leadframe and to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board, the leadframe and the electronic circuit element such that the test pad of the circuit board is exposed in an upper body surface of the body, and the signal pad portions of the leads of the leadframe are exposed in a lower body surface of the body.

Memory card and its manufacturing method

A memory card comprising a die paddle having opposed, generally planar first and second die paddle surfaces and multiple peripheral edge segments. Disposed along and in spaced relation to one of the peripheral edge segments of the die paddle is a plurality of contacts, each of which has opposed, generally planar first and second contact surfaces. An inner body partially encapsulates the die paddle and the contacts, the first contact surface of each of the contacts and the first die paddle surface of the die paddle being exposed in and substantially flush with a generally planar first inner body surface of the inner body. The inner body further defines a generally planar second inner body surface which is disposed in opposed relation to the first inner body surface, the second contact surface of each of the contacts being exposed in the second inner body surface. At least one electronic circuit element is attached to the first die paddle surface and electrically connected to at least one of the contacts. An outer body partially encapsulates the inner body such that the first die paddle surface, the first contact surface of each of the contacts, the first inner body surface and the electronic circuit element are covered by the outer body, with the second inner body surface and hence the second contact surface of each of the contacts not being covered by the outer body and thus exposed.

An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.

Optic semiconductor module and manufacturing method

A memory card comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Disposed on and extending from the die pad and the traces is a plurality of stand-offs. At least one semiconductor die is attached to the die pad and electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body.

Fully-molded leadframe stand-off feature

An optic semiconductor package includes a plate shaped substrate having an insulation layer through which two spaced apart layer apertures are formed. The substrate further includes a plurality of electrically conductive patterns formed on the wall surfaces of the layer apertures and a lower surface of the insulation layer. One of a laser diode and a photo detector are disposed in a different one of the two layer apertures and are each electrically connected to the electrically conductive patterns through conductive bumps formed on the laser diode and the photo detector. An insulation plate, having a plurality of plate apertures formed through portions of the insulation plate adjacent to the electrically conductive patterns, is coupled to the lower surface of the substrate. One of a plurality of conductive pins electrically connected with the electrically conductive patterns is fitted in each of the plate apertures of the insulation plate and extends downward from the insulation plate. An integral metal cap is attached to upper and side portions of the substrate to protect the substrate, the laser diode, and the photo detector from the outside environment. The metal cap has an opening formed in its ceiling. A glass is attached below the opening to enable light to be transmitted through the glass from the laser diode to an exterior device and from an exterior device to the photo detector.

Growing community of inventors

Gangdong-gu, South Korea

Chul Woo Park