Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Displayco., Ltd.

Chul Won Park

Pil Soon Hong

Gwui-Hyun Park

Bo Geon Jeon

Koichi Sugitani

Hoon Jong Kang

Yang-Ho Jung

Jin Ho Ju

Kilsoo Kim

In Cheol Lee

Gwui Hyun Park

Hyun Joo Lee

Min Hyuck Kang

Tae Gyun Kim

Sun-Won Kang

Joong-Hyun Baek

Jeong Min Park

Jeong Won Kim

Bong-Yeon Kim

Jun Hyuk Woo

Kil-soo Kim

Won-Hoe Koo

Hyung Bin Cho

Dae Youn Park

Hye In Kim

Yun Seok Woo

Hyun Jin Son

Sae Hee Han

Kwang-Jo Jung

Il Seok Lee

Dong Il Lim

Deok Hee Hee Han

Yong-Gwon Lee

Cheol-Hoon Park

Sang-Hoon Chu

A stretchable display device includes a stretchable substrate including a plurality of island areas that are separated from each other and a hinge area connecting the plurality of island areas, a plurality of display units respectively located in each of the plurality of island areas, a wiring part connecting the plurality of display units and located at the hinge area, and an insulating layer between the stretchable substrate and the plurality of display units. The insulating layer includes an opening overlapping the hinge area.

Stretchable display device

A display device includes a first via layer on a substrate and including trench parts recessed from an upper surface of the first via layer, a first electrode and a second electrode on the first via layer and spaced apart from each other, a second via layer on the first via layer and including first openings partially exposing the first electrode, and a second opening partially exposing the second electrode, light emitting elements in the first openings of the second via layer and extending in a direction, and a third electrode on the second via layer. Each of the light emitting elements includes a first end electrically connected to the first electrode and a second end electrically connected to the third electrode such that the extending direction of the light emitting elements is not parallel to an upper surface of the substrate.

Display device

A display device and a method of manufacturing a display device are provided. An embodiment of a display device includes a substrate; a first conductive layer disposed on the substrate; a first insulating layer disposed on the first conductive layer; a second conductive layer connected to the first conductive layer through a first contact hole in the first insulating layer; a second insulating layer filling an inside of the first contact hole; and a third insulating layer disposed on the second conductive layer and the second insulating layer. The first insulating layer includes a first region that overlaps the second conductive layer and a second region that does not overlap the second conductive layer, and a top surface of the first region of the first insulating layer is positioned higher than a top surface of the second region of the first insulating layer.

Display device having varying thickness insulating layer

Stretchable display device with insulation layer disposed on stretchable substrate

An organic light emitting diode (OLED) display includes a first substrate, a second substrate facing the first substrate, a sealing member interposed between the first substrate and the second substrate, the sealing member including a siloxane material, a semiconductor layer on the first substrate, a planarization layer on the semiconductor layer, and a barrier rib on the planarization layer. The planarization layer or the barrier rib may also include the siloxane material.

Organic light emitting display device and method of manufacturing the same

A light emitting diode display includes a first electrode, a second electrode overlapping the first electrode, a light emission layer between the first electrode and the second electrode, a pixel defining layer overlapping a part of the first electrode, the pixel defining layer and the light emission layer being spaced apart from each other in a top view, and an inorganic layer between the first electrode and the light emission layer, and an edge of the inorganic layer overlapping the light emission layer and the pixel defining layer.

Light emitting diode display

A semiconductor package comprises a package substrate; a first chip stack and a second chip stack mounted side by side on the package substrate, wherein the first and second chip stacks each include a plurality of semiconductor chips stacked on the package substrate, wherein each of the semiconductor chips includes a plurality of bonding pads provided on a respective edge region thereof, wherein at least some of the plurality of bonding pads are functional pads, and wherein the functional pads occupy a region that is substantially less than an entirety of the respective edge region.

Semiconductor package including stepwise stacked chips

A touch panel includes: a uni-axially oriented base film; a transparent electrode pattern layer positioned on the uni-axially oriented base film; a first passivation layer formed in an edge region of the transparent electrode pattern layer and covering end portion side walls of the transparent electrode pattern layer; and a contact hole positioned on the first passivation layer and exposing the first passivation layer.

Touch panel and method for manufacturing the same

A liquid crystal display including: a first insulating substrate; a plurality of color filters disposed on the first insulating substrate; a light blocking member disposed on the color filters; a second insulating substrate facing the first insulating substrate; and a spacer disposed between the first insulating substrate and the second insulating substrate. The spacer includes a main column spacer and a sub-column spacer spaced apart from each other by a predetermined distance, a protrusion protruding toward the second insulating substrate by stacking at least one sub-color filter on the color filter, the main column spacer is disposed on the protrusion, and the light blocking member and the spacer are made of the same material.

Liquid crystal display and method for manufacturing the same

In a semiconductor package, a circuit pattern is arranged in a circuit board and contact pads on the circuit board are connected with the circuit pattern. Contact terminals contact external contact elements on a first surface of the circuit board. An integrated circuit (IC) chip structure is mounted on the circuit board and electrically connected to the inner circuit pattern. An operation controller on the circuit board controls operation of the semiconductor package according to the package users' individual choice.

Semiconductor package

A pattern mask for patterning a thin film includes a transparent or translucent substrate with a plurality of grooves formed thereon having a pitch of about 4.6 &#x3bc;m to about 10.8 &#x3bc;m.

Pattern mask and method of manufacturing thin film pattern using pattern mask

A semiconductor package includes a semiconductor chip stack disposed between first and second leads near first and second sides of the package and including a plurality of semiconductor chips, and a redistribution structure disposed on the semiconductor chip stack. At least one semiconductor chip of the semiconductor chip stack includes a plurality of first chip pads disposed near or closer to a third side of the package. The redistribution structure includes a first redistribution pad disposed near or closer to the first side and electrically connected to the first lead, a second redistribution pad disposed near or closer to the second side and electrically connected to the second lead, and a third redistribution pad disposed near or closer to the third side and electrically connected to a first one of the first chip pads and the first redistribution pad.

Integrated circuit packages having redistribution structures

Growing community of inventors

Hwaseong-si, South Korea

Chul Won Park