Korea Institute of Industrial Technology

Piezonics Co., Ltd.

Piezonics Co., Ltd.; Korea Institute of Industrial Technology

Piezonica Co., Ltd.

Byun, Chul Soo

Chul Soo Byun

Man Cheol Han

Il Yong Chung

Moon Soo Park

Young Seok Choi

Jaichan Lee

Kyung Tae Kang

Young June Cho

A reaction chamber for a chemical vapor apparatus is disclosed. The reaction chamber for the chemical vapor apparatus comprises a housing including an internal space and a susceptor disposed in the internal space so that a substrate is loaded on an upper surface of the susceptor. A shower head is disposed above the susceptor in the internal space of the housing to spray process gas towards the substrate side. An inner barrel with open top and bottom is placed inside the internal space of the reaction chamber so that an upper edge of the barrel is positioned near the showerhead to enclose the substrate and the susceptor. A driving part is connected to the inner barrel. When it is needed to replace the susceptor and the substrate, the inner barrel is changed into an open state in which the substrate and the susceptor disposed in the inner barrel are exposed to the outside of the inner barrel by an operation of the driving part. The inside of the reaction chamber for the chemical vapor apparatus is always closed and thus the reaction chamber is capable of easily replacing a substrate or a susceptor while the vacuum in the reaction chamber is still maintained.

Reaction chamber for chemical vapor apparatus

A showerhead is provided. The showerhead includes a body and a plurality of first dispersion pins. The body has one side having a plurality of injection holes penetrated therethrough and the other side facing the one side. The plurality of first dispersion pins protruding from the plurality of spray holes of the one side to the other side such that end portions thereof support the other side. The first dispersion holes have first gas inlet holes on one side and first passages connected to the first gas inlet holes therein. Gas introduced between the one side and the other side is immediately discharged to the outside of the body through the plurality of spray holes by passing the first gas inlet holes and the first passages.

Shower head for electronic device having dispersion pins fabrication and shower head assembly

A showerhead for chemical vapor deposition includes: a plurality of reactive gas showerhead modules separated each other and having the same number as the number of kinds of reactive gases injected from the showerhead, each having a mixing zone in the reactive gas showerhead module to induce a mixing of a reactive gas and an injection support gas used to regulate the injection velocity of the reactive gas and a plurality of reactive gas injection tubes connected to the bottom surface of the reactive gas showerhead module for injecting the reactive gas mixed with the injection support gas over the substrate; and a purge gas showerhead module mounted under the reactive gas showerhead modules, with a purge gas supply port for supplying a purge gas to the purge gas showerhead module.

Apparatus of chemical vapor deposition with a showerhead regulating injection velocity of reactive gases positively and method thereof

A method for chemical vapor deposition using a showerhead through which at least one reactive gas and a purge gas are injected over a substrate, wherein the method includes: disposing the showerhead such that the bottom surface of the showerhead is spaced apart from the substrate by a predetermined distance; supplying a reactive gas and an injection support gas into the showerhead, wherein reactive gases of different kinds are respectively delivered into compartments formed at inside of the showerhead; mixing each reactive gas with its corresponding injection support gas in each mixing zone at inside of the showerhead; supplying a purge gas into a separated compartment at inside of the showerhead; and injecting the reactive gas mixed with the injection support gas and the purge gas through a plurality of reactive gas exits and a plurality of purge gas exits formed at the bottom surface of the showerhead, respectively.

The present invention is related to an apparatus and a method for chemical vapor deposition (CVD) using a showerhead through which a reactive gas of at least one kind and a purge gas is injected over a substrate on which a film is growing. A plural number of reactive gas showerhead modules are laid on a purge gas showerhead module. Each reactive gas is injected from a bottom of the showerhead after flowing through the showerhead as separated, thereby preventing the reactive gases from causing homogeneous gas phase reactions and from generating unwanted particles at the inside of the showerhead. And a purge gas is injected from the bottom surface of the showerhead by forming a protective curtain, thereby suppressing diffusion of the reactive gas injected backwardly. Each reactive gas is mixed with an injection support gas which is a kind of inert gas in a mixing zone at inside of the showerhead, where the injection velocity of each reactive gas is regulated positively by the amount of the injection support gas mixed. The present invention further includes an apparatus and a method, wherein the showerhead is cooled by a cooling jacket which keeps the temperature of the showerhead at proper levels to prevent both the condensation and the thermal decomposition of the reactive gas used.

Disclosed is an apparatus for chemical vapor deposition (CVD) with a showerhead through which a source material gas is injected over a substrate to deposit a film on the substrate. The showerhead includes: a plurality of reactive gas showerhead modules having the same number as the kind of reactive gases of the source material gas, each reactive gas showerhead module having inner spaces separated from each other and a plurality of reactive gas flow channels formed on the bottom surface thereof for supplying the reactive gas over the substrate; and a purge gas showerhead module mounted under the reactive gas showerhead modules, having a purge gas supply port for introducing a purge gas of the source material gas thereto, an inner space separated from inner spaces of the reactive gas showerhead modules for being filled with the purge gas only, a plurality of inlets formed on the upper surface thereof for allowing a penetration of the said reactive gas flow channels through the inner space thereof with hermetic sealing at the joints of the said inlets, a plurality of exits for said reactive gas flow channels and a plurality of exits for said purge gas formed on the bottom surface thereof, and said exit for purging gas having a diameter smaller than that of said exit for the reactive gas flow channel, and wherein each reactive gas flow channel of each reactive gas showerhead module placed at upper positions passes through the inside of the other reactive gas showerhead modules placed at lower positions and through the inside of the purge gas showerhead module.

Apparatus for chemical vapor deposition (CVD) with showerhead

Disclosed is a piezoelectric ink jet printer head in which a chamber and an ink storage are integrally formed. A process for manufacturing the ink jet printer head is also disclosed. The ink jet printer head formed by laminating a plurality of plates includes: a) an actuator portion being composed of upper and lower electrodes, a piezoelectric plate inserted between the upper and lower electrodes, a protection layer placed on the upper electrode, and a resilient plate disposed beneath the lower electrode; b) an ink passage portion composed of a spacer disposed beneath the resilient plate and forming a side portion of a chamber, a channel plate disposed beneath the spacer, the channel plate forming an ink passage in one side of the chamber and simultaneously expanding the chamber, and a nozzle plate disposed beneath the channel plate, the nozzle plate forming the lower side of the chamber and having a nozzle communicating with the chamber; and c) an ink-supplying portion formed by a through-hole reaching the ink passage of the channel plate through the actuator portion and the spacer.

Piezoelectric ink jet printer head and its manufacturing process

Disclosed is a method of chemical vapor deposition (CVD). The method provides for use of a showerhead through which a source material gas including a reactive gas of at least one kind and a purge gas is injected over a substrate located in a reaction chamber to deposit a film on the substrate. The showerhead has reactive gas outlets surrounded by purge gas outlets. The bottom surface of the showerhead is spaced apart from the substrate by a predetermined distance. Reactive gases of different kinds are injected into compartments formed inside the showerhead so that each compartment of the showerhead is filled with the reactive gas of only one kind, and a purge gas of the source material gas is supplied into another compartment formed inside the showerhead. The reactive gas and the purge gas are discharged through the reactive gas outlets and purge gas outlets. Preferably, there are more purge gas outlets than reactive gas outlets.

Growing community of inventors

Seoul, South Korea

Chul Soo Byun