Sensorview Co., Ltd.

Chul-Keun Park

Byoung Nam Kim

Hong Il Yoo

Chan-Woo Park

Jong Yup Lee

Kyung Hwan Kim

A method for producing a substrate for millimeter wave comprises the steps of: (a) mixing ceramic powder and Teflon powder; (b) dispersing the mixed ceramic powder and Teflon powder in a dispersion equipment; (c) after the step of (b) dispersing is completed, outputting a paste of a mixture of the ceramic powder and the Teflon powder by additionally adding a solution and a binder to the dispersion equipment and then dispersing the mixture; (d) applying the paste to a first metal thin film; (e) drying the first metal thin film to which the paste is applied; and (f) laminating a second metal thin film on the opposite side of the paste bonded to the dried first metal thin film and then thermally bonding it.

Method for producing substrate for millimeter wave

A short-range communication antenna for multi-link communication includes a plurality of radiators each independently set to transmit and receive different signals and having a predetermined array structure, in which each of the plurality of radiators includes: a patch-shaped radiating element; a first parasitic element formed to surround the radiating element; and a second parasitic element formed to surround the first parasitic element, wherein each of the plurality of radiators is rotated +90 degrees or −90 degrees compared to adjacent radiators.

Short-range communication antenna for multi-link communication

A horn antenna for a millimeter wave comprises: a horn radiator including a radiation part having an opening formed therein to radiate a feed signal, and a multi-layer PCB coupling part coupled to lower and side portions of the radiation part to provide a feed signal; and a multi-layer PCB coupled to a lower portion of the multi-layer PCB coupling part to provide a feed signal, wherein a slot and a groove connected to the slot and extending in a direction parallel to the multi-layer PCB are formed in the multi-layer PCB coupling part, wherein a feed line vertically overlapping the slot and the groove is formed on a first layer substrate, which is the uppermost layer of the multi-layer PCB, wherein the opening extends in a direction parallel to the multi-layer PCB, and wherein a '¬'-shaped waveguide extending from the slot is formed in the horn radiator.

Horn antenna for millimeter wave

An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.

Growing community of inventors

Seongnam-si, South Korea

Chul-Keun Park