Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Inno Qd Co., Ltd

Chul Hwan Park

Sang Woo Kim

Nam Jin Kim

Mi Kyung Kim

Gwang-Man Lim

Oh Kwan Kwon

Kun-dae Yeom

Jong Uk Bu

Jae Gyun Choi

Hysong-seob Kim

Proposed are a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.

Method for preparing quantum dot film, quantum dot film prepared thereby, and wavelength conversion sheet and display comprising same

The present invention relates to a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.

Method for manufacturing quantum dot film comprising encapsulated quantum dots uniformly dispersed therein, quantum dot film manufactured thereby and wavelength conversion sheet and display comprising same

A functional polarizing film includes a polarizing layer, at least one moisture-binding layer on a first surface of the polarizing layer, and at least one moisture-blocking layer disposed on a first surface of the moisture-binding layer.

Functional polarizing film and organic light emitting display apparatus including the same

Functional polarizing film and organic light-emitting display apparatus including the same

Organic light-emitting display apparatus

Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

Semiconductor package including multiple chips and separate groups of leads

Growing community of inventors

Yongin-si, South Korea

Chul Hwan Park