Tencent Technology (shenzhen) Company Limited

Chinese Academy of Sciences

Tencent Technology Company Limited

Chuhong Yang

Shengyu Zhang

Wenlong Zhang

Yarui Zheng

Yu Zhou

Zhenxing Zhang

Yicong Zheng

Sainan Huai

Maochun Dai

Yongdan Huang

Biao Wu

Jiagui Feng

Kanglin Xiong

Sunan Ding

Xiao Chen

This application discloses methods and devices for a quantum chip, a quantum processor and a quantum computer, and relates to the field of quantum technology. The quantum chip includes a bottom sheet and a top sheet; a qubit array disposed on the top sheet, the qubit array comprising a plurality of qubits distributed in an array structure of M rows by N columns, and M and N being both integers greater than 1; a reading cavity disposed on the bottom sheet, and the reading cavity being configured to acquire status information of a qubit in the qubit array; and the bottom sheet and the top sheet being electrically connected.

Quantum chip, quantum processor and quantum computer

A method for manufacturing an air bridge, an air bridge, and an electronic device are disclosed. The method for manufacturing an air bridge includes: applying a first photoresist layer to a substrate; applying a second photoresist layer to the first photoresist layer; exposing, developing, and fixing the second photoresist layer, to form a patterned structure; etching away the first photoresist layer in a specified area through the patterned structure, to form a structure for blocking a deposition material from diffusing to a periphery on the substrate, the specified area including a projection area formed on the first photoresist layer by a top opening of the patterned structure; and depositing a bridge support structure on a surface of the substrate exposed after the first photoresist layer in the specified area is etched away, and forming an air bridge based on the bridge support structure.

Manufacturing method of air bridge, air bridge and electronic device

This disclosure discloses a method for preparing an indium pillar, a chip substrate and a chip. The method includes: applying a first photoresist layer on a substrate; applying a second photoresist layer on the first photoresist layer; covering a part of a surface of the second photoresist layer; underexposing the part of the second photoresist layer to obtain a processed second photoresist layer; developing and fixing the processed second photoresist layer to form an undercut structure; etching the first photoresist layer through the undercut structure to form an expose area; and depositing an indium material on the exposed area to form an indium pillar solder.

Method for preparing indium pillar solder, chip substrate and chip

Growing community of inventors

Shenzhen, China

Chuhong Yang