Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Boe Mled Technology Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Chuhang Wang

Lili Wang

Chao Liu

Linhui Gong

Ke Meng

Qiangwei Cui

Jing Wang

Ming Zhai

Sha Feng

Mingming Jia

Yutian Chu

Fan Yang

Feng Qu

Jing Liu

Haiwei Sun

Qi Qi

Huan Wang

Donghui Wang

Zhaohui Li

Zhenxing Tang

A display panel includes a display substrate having a display area and at least one wiring area, and a protective film including a first protective portion and at least one second protective portion. The first protective portion is disposed on a display side of the display substrate, and covers the display area. The at least one second protective portion each covers a wiring area in the at least one wiring area, and is bent from the display side of the display substrate to a non-display side of the display substrate, by a side of the display substrate. The at least one second protective portion each includes a main film layer and a wiring layer. The wiring layer includes a plurality of wirings. At least one wiring extends from the display side of the display substrate to the non-display side of the display substrate, by the side of the display substrate.

Display panel and manufacturing method thereof, and display device

A display panel includes a backplane, back traces, side traces and blocking portions. The backplane includes a display surface, a non-display surface, and side surfaces connected to the two surfaces, where a side surface is a selected side surface. The back traces and the blocking portions are arranged on the non-display surface. Each back trace includes a first line segment and a second line segment, whose extension directions intersect. The side traces are arranged on the selected side surface. Of each side trace, an end is on the display surface, and the other end is on the non-display surface. Each side trace is electrically connected to a first line segment in a respective back trace, where the first line segment has the same extension direction as the other end of each side trace. Two adjacent first line segments are provided with a blocking portion therebetween.

Display panel, display device and tiled display apparatus

An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region; a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, in the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.

Array substrate and preparation method therefor, and display panel and display device

A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.

Micro-LED transfer method and display panel

The present disclosure discloses a display panel and a method for manufacturing the same, a bonding method, and a display device. The display panel is provided with a bonding area and includes a bonding structure in the bonding area, and the bonding structure is provided with a through hole penetrating along a thickness direction of the bonding structure. The present disclosure helps to improve the bonding efficiency between the display panel and a flexible printed circuit.

Display panel and method for manufacturing same, bonding method, and display device

A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.

Driving substrate and manufacturing method thereof, and display device

A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

Chip bonding method and bonding device

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Beijing, China

Chuhang Wang