Hangzhou First Applied Material Co., Ltd.

Chufeng Yang

Wei Deng

Hongbing Hou

Yan Sang

Mingjie Cao

Haonan Wang

Dayue Jin

Yunxiao Mei

The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 Ω·cm.

Anti-PID encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing method

Growing community of inventors

Zhejiang, China

Chufeng Yang