Asm Technology Singapore Pte Ltd

Chuek Wah Tang

Gary Peter Widdowson

Pak Kin Leung

Yi Kei Law

Jiang Wen Deng

Wing Chiu Lai

Kin Fung Yu

A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.

Bond head cooling apparatus

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Atomization mechanism for cooling a bond head

Growing community of inventors

Hong Kong, China

Chuek Wah Tang