Cabot Corporation

Chuck Edwards

Karel Vanheusden

Mark J Hampden-Smith

Toivo T Kodas

James F Caruso

Scott T Haubrich

Aaron Stump

Allen B Schult

Mark H Kowalski

Anthony R James

Klaus Kunze

Hyungrak Kim

Hyungrak Kiim

Nathan E Stott

James John Howarth

Aaron D Stump

A composition for the fabrication of reflective features using a direct-write tool is disclosed. The composition comprises metal nanoparticles having an average particle size less than 300 nm and which carry thereon a polymer for substantially preventing agglomeration of the nanoparticles, wherein the nanoparticles exhibit a metal-polymer weight ratio of 100:1 to 10:1. The composition further includes a vehicle for forming a dispersion with the metal nanoparticles. A number of electronic devices comprising a reflective layer formed from the composition are also disclosed. One example case provides an electronic device having a reflective electrode. The reflective electrode comprises a percolation network of the metal nanoparticles embedded in a matrix of the polymer and having an average particle size of less than 300 nm, wherein the reflective electrode is reflective in the visible light range and does not diffract incident light.

Metal nanoparticle compositions for reflective features

A metal nanoparticle composition for the fabrication of conductive features. The metal nanoparticle composition advantageously has a low viscosity permitting deposition of the composition by direct-write tools. The metal nanoparticle composition advantageously also has a low conversion temperature, permitting its deposition and conversion to an electrical feature on polymeric substrates.

Metal nanoparticle compositions

An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet printing process. The inkjet printing process may include the step of printing a plurality of layers, wherein a first layer includes at least one electronic ink deposited directly onto the substrate, and wherein each subsequent layer includes at least one electronic ink deposited on top of at least a portion of a previous layer when the previous layer has been cured. One or more of the layers may include at least two of the electronic inks.

Optimized multi-layer printing of electronics and displays

A system and process for compensating for non-uniform surfaces of a substrate when direct printing traces is provided. The system and process provided herein measures the surface of a substrate and can determine whether the surface is substantially flat, rises or falls, or whether a mesa or valley is encountered. Depending on the surface feature (i.e., mesa, valley, falling or rising surface), the direct printing system can change the frequency of the printing timing signal, advance or retard the print timing signal, advance or retard the print data, or make repeated passes over certain areas. In addition, the process disclosed herein can determine whether two, three or all of the aforementioned steps for compensating for non-uniform substrates should be combined to most effectively and efficiently print on the non-uniform surface of the substrate as intended.

Printable electronic features on non-uniform substrate and processes for making same

Processes for the production of metal nanoparticles. In one aspect, the invention is to a process comprising the steps of mixing a heated first solution comprising a base and/or a reducing agent (e.g., a non-polyol reducing agent), a polyol, and a polymer of vinyl pyrrolidone with a second solution comprising a metal precursor that is capable of being reduced to a metal by the polyol. In another aspect, the invention is to a process that includes the steps of heating a powder of a polymer of vinyl pyrrolidone; forming a first solution comprising the powder and a polyol; and mixing the first solution with a second solution comprising a metal precursor capable of being reduced to a metal by the polyol.

Production of metal nanoparticles

A process for the production of metal nanoparticles. The process comprises a rapid mixing of a solution of at least about 0.1 mole of a metal compound that is capable of being reduced to a metal by a polyol with a heated solution of a polyol and a substance that is capable of being adsorbed on the nanoparticles.

A process for the production of metal nanoparticles. Nanoparticles are formed by combining a metal compound with a solution that comprises a polyol and a substance that is capable of being adsorbed on the nanoparticles. The nanoparticles are precipitated by adding a nanoparticle-precipitating liquid in a sufficient amount to precipitate at least a substantial portion of the nanoparticles and of a protic solvent in a sufficient amount to improve the separation of the nanoparticles from the liquid phase.

Separation of metal nanoparticles

A system and process for manufacturing custom printed circuit boards on pre-provided substrates, wherein the substrate is pre-provided with standard integrated circuits. The standard integrated circuits are pre-provided on the substrate in a conventional manner, such as by standard integrated circuit technologies, in many different packing technologies. The user designs the custom printed circuit board using a design tool to perform one or more specific electronic functions, based on the pre-provided electronic devices, and/or custom designed and direct printed electronic devices. The electronic devices includes transistors, resistors, capacitors, among other types of devices. The system and process allows users to customize standard 'generic' circuit boards with some known electronic functions for their own particular application. Examples of such uses include displays, the automotive industry and many others.

Growing community of inventors

Rio Rancho, NM, United States of America

Chuck Edwards