Advanced Micro Devices Corporation

Chuck Anderson

Paul J Sokolovsky

A fixture for mounting and aligning a heat sink to a PGA chip package disposed in a Murphy-type carrier includes a substantially flat, rectangularly-shaped plate (51), a first end portion (53a), and a second end portion (53b). The plate member (51) has a top surface (54) and a bottom surface (52). The plate member (51) further includes a top side edge (44), a bottom side edge (46), a left side edge (48) and a right side edge (50). Retaining means are formed in a central portion of the bottom surface (52) of the plate member (51) to releasably hold the heat sink. The first and second end portions (53a, 53b) are pivotally connected on opposite sides of two of the four side edges (44-50) of the plate member (51) and include hooked portions (70a, 70b) for releasably engaging a bottom surface of the Murphy-type carrier. The first and second end portions (53a, 53 b) further include actuating members (66a, 66b) for moving outwardly the hooked portions (70a, 70b) away from the center of the plate member (51) when they are squeezed toward each other so as to permit mounting or removal of the fixture to the Murphy-type carrier.

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Santa Clara, CA, United States of America

Chuck Anderson