Shennan Circuits Co., Ltd.

Chuanzhi Li

Hua Miao

Zhanhao Xie

Jun Peng

Xudong Chen

The present disclosure discloses a printed circuit board, a method for manufacturing the same and an electronic device. The PCB includes: a core board assembly including a first core board and a second core board which are stacked together, wherein the second core board includes a metal layer formed on a side of the second core board oriented towards the first core board, and the first core board defines a through slot extending through the first core board; a radiator, disposed in the through slot; and a conductive adhering layer, disposed between the metal layer of the second core board and the radiator, wherein the conductive adhering layer is configured to electrically connect the radiator and the metal layer. The present disclosure connects the radiator directly with the metal layer. The implementation of the present disclosure may help cooling the metal layer to improve the cooling performance of the PCB.

Printed circuit board, method for manufacturing the same and electronic device

A printed circuit board (PCB), a method for processing PCB and an electronic apparatus. The method for processing PCB may comprise: forming a hole in the PCB, wherein the PCB includes a metal matrix and at least two substrate layers, at least one of the at least two substrate layers has a geoelectric layer thereon; and the metal matrix is fixed in a slot provided in the substrate, the formed hole contacts both the geoelectric layer and the metal matrix; and providing conductive substances in the hole, with the conductive substances in the hole being in contact with the inner geoelectric layer and the metal matrix, so that the geoelectric layer and the metal matrix are in conduction with each other.

Growing community of inventors

Shenzhen, China

Chuanzhi Li