Beijing Zitiao Network Technology Co., Ltd.

Chuansheng Cheng

Jian Wang

Dayong Shen

According to embodiments of the present disclosure, a printed circuit and manufacturing method thereof are provided. The printed circuit board comprises: a signal plane portion comprising a plurality of metal layers for transmitting a signal; a power plane portion overlaid with the signal plane portion through a connection layer and comprising a plurality of metal layers for providing power; a plurality of power vias each extending from a surface of the signal plane portion facing away from the power plane portion, through the signal plane portion, the connection layer, and the power plane portion, to a surface of the power plane portion facing away from the signal plane portion; and a plurality of signal vias each extending from a surface of the signal plane portion facing away from the power plane portion into the signal plane portion and not into the power plane portion.

Printed circuit board and manufacturing method thereof

According to embodiments of the present disclosure, a laminated unit for a printed circuit board and a printed circuit board are provided. The laminated unit includes a plurality of metal layers and a plurality of dielectric layers alternately stacked in a thickness direction, wherein the plurality of metal layers include a signal transmission layer and a pair of reference layers disposed on two sides of the signal transmission layer; at least one of two dielectric layers adjacent to the signal transmission layer is arranged as a resin isolation layer; and the dielectric layers on sides of the pair of reference layers opposite to the signal transmission layer are arranged as reinforcing layers, and the reinforcing layers include a substrate and a resin material arranged around the substrate.

Growing community of inventors

Beijing, China

Chuansheng Cheng