Intel Corporation

Chuanlou Wang

Jun Lu

Prabhakar Subrahmanyam

Ying-Feng Pang

Tong Wa Chao

Yi Xia

Ridvan A Sahan

Guoliang Ying

Rahima K Mohammed

Liguang Du

Victor Polyanko

Guangying Zhang

Peng Wei

Xiang Que

Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

Technologies for isolated heat dissipating devices

Growing community of inventors

Shanghai, China

Chuanlou Wang