Applied Materials, Inc.

Chuang-Chia Lin

Upendra V Ummethala

David John Peterson

Wenwei Qiao

Philip Allan Kraus

Lei Lian

Steven E Babayan

Amir Bayati

Surajit Kumar

Andrew Choe

A sensor system includes a processing chamber and a sensor assembly disposed within the processing chamber. The sensor assembly includes a substrate and a plurality of sensors including at least one of pressure sensors or flow sensors disposed across a surface of the substrate. Each respective sensor is adapted to measure a respective pressure or a respective flow of an environment proximate the respective sensor. The sensor system further includes a processing device communicatively coupled to the sensor assembly. The processing device is adapted to receive at least one of the measured respective pressures or the measured respective flows and determine a pressure distribution or a flow distribution of the processing chamber.

In-chamber low-profile sensor assembly

Embodiments disclosed herein include diagnostic substrates and methods of using the diagnostic substrates to extract plasma parameters. In an embodiment, a diagnostic substrate comprises a substrate and an array of resonators across the substrate. In an embodiment, the array of resonators comprises at least a first resonator with a first structure and a second resonator with a second structure. In an embodiment, the first structure is different than the second structure.

MEMS resonator sensor substrate for plasma, temperature, stress, or deposition sensing

Embodiments disclosed herein include a diagnostic substrate. In an embodiment, the diagnostic substrate comprises a substrate, a circuit board on the substrate, and a spectrometer coupled to the circuit board. In an embodiment, the diagnostic substrate further comprises a processor on the circuit board and communicatively coupled to the spectrometer.

Optical spectrum sensor wafer or robot for chamber condition monitoring

Embodiments disclosed herein include sensor devices and methods of using the sensor devices. In an embodiment, a sensor device comprises a substrate, a support extending up from the substrate, and a resonator mechanically coupled to the support. In an embodiment, the sensor device further comprises an antenna that is configured to electromagnetically couple with the resonator, wherein the antenna is connected to a transmission line in the substrate.

Microwave resonator array for plasma diagnostics

A sensor assembly that includes a substrate and a set of sensors. The set of sensor includes pressure sensor and/or flow sensors located across a surface of the substrate. Each respective sensor of the plurality of sensor is adapted to measure a respective pressure or a respective flow of an environment proximate the respective sensor. Each respective sensor of the plurality of sensor may further be adapted to output a respective signal associated with the measured respective pressure or the measured respective flow. The respective signals associated with the measured respective pressure or the measured respective flows measured by the plurality of sensor together provide a pressure distribution across the surface of the substrate and/or a flow distribution across the surface of the substrate.

A sensor assembly that includes a surface acoustic wave (SAW) sensor. The SAW sensor is adapted to measure a first environmental condition in response to receiving an RF signal. The SAW sensor includes a substrate having a layer of piezoelectric material. The SAW sensor further includes a interdigitated transducer (IDT) formed on the piezoelectric material. The IDT includes two comb-shaped electrodes having interlocking conducting digits in a first arrangement. The interlocking conducting digits in the first arrangement generates a first signal modulation of an RF signal received by the first IDT. The first signal modulation identifies the first SAW sensor.

Surface acoustic wave sensor assembly

A sensor device that includes an integrated sensor assembly having a surface acoustic wave (SAW) sensor disposed on a piezoelectric substrate. The SAW sensor is adapted to measure an environmental condition of an environment in response to an RF signal. The SAW sensor includes an interdigitated transducer (IDT) formed on a substrate having at least a layer of a piezoelectric material. The SAW sensor includes either one or more SAW reflectors of a second IDT formed on the piezoelectric material. The SAW sensor further includes an RF antenna formed on the piezoelectric material. The SAW sensor and the RF antenna are integrated with one another on the piezoelectric material.

Embodiments disclosed herein include optical sensor systems and methods of using such systems. In an embodiment, the optical sensor system comprises a housing and an optical path through the housing. In an embodiment, the optical path comprises a first end and a second end. In an embodiment a reflector is at the first end of the optical path, and a lens is between the reflector and the second end of the optical path. In an embodiment, the optical sensor further comprises an opening through the housing between the lens and the reflector.

In-situ optical chamber surface and process sensor

Embodiments disclosed herein include an optical sensor system for use in plasma processing tools. In an embodiment, the optical sensor system, comprises an optically clear body with a first surface and a second surface facing away from the first surface. In an embodiment, the optically clear body further comprises a third surface that is recessed from the second surface. In an embodiment, the optical sensor system further comprises a target over the third surface and a first reflector to optically couple the first surface to the target.

Optical wall and process sensor with plasma facing sensor

Embodiments include systems and methods for determining a processing parameter of a processing operation. Embodiments include a diagnostic substrate for determining processing parameters of a processing operation. In an embodiment, the diagnostic substrate comprises a substrate, a circuit layer over the substrate, and a capping layer over the circuit layer. In an embodiment, a micro resonator sensor is in the circuit layer and the capping layer. In an embodiment, the micro resonator sensor comprises, a resonating body and one or more electrodes for inducing resonance in the resonating body.

Micro resonator array sensor for detecting wafer processing parameters

Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.

High quality factor embedded resonator wafers

Embodiments include systems and methods for determining a processing parameter of a processing operation utilizing micro resonator sensors. Some embodiments include a diagnostic substrate comprising a substrate, a circuit layer over the substrate, a cavity in the circuit layer, a capping layer over the circuit layer, a resonating body in or over the cavity, one or more electrodes in the cavity, and circuitry for driving and sensing the resonant frequency of the resonating body. In an embodiment, the circuitry comprises a biasing circuitry block configured to provide a bias voltage to the one or more electrodes, a frequency generator circuitry block configured to provide a signal with a varying frequency to the one or more electrodes, and a sensing circuitry block configured to detect a value correlated to oscillation of the resonating body.

Micro resonator array system

Embodiments include systems and methods for determining a processing parameter of a processing operation. Some embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a sensing region across the capping layer. In an embodiment, the sensing region comprises, an array of first micro resonators and a second micro resonator. In an embodiment, the array of first micro resonators surround the second micro resonator.

Growing community of inventors

San Ramon, CA, United States of America

Chuang-Chia Lin