Foshan Nationstar Optoelectronics Co., Ltd. Corporation

Chuanbiao Liu

Kuai Qin

Feng Gu

Xiaofeng Liu

Kailiang Fan

Yuanbin Lin

Xi Zheng

Qiang Zhao

Zongxian Xie

Zhuang Peng

Lu Yang

Ling Li

Yan Liu

Heng Guo

Xiaolong Huang

Chungan Jiang

Changqi Wang

Danwei Li

Xiangling Luo

Hu Xu

Aidi Chen

Hongxin Chen

Mingjun Zhu

Tinghong Yang

Provided is an LED display unit group, comprising: an insulation substrate, a front circuit board, and a back circuit board. The front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns. Each pixel area comprises three A-electrode pads, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips. In each pixel area, the electrode A of each LED light-emitting chip is electrically connected to a corresponding A-electrode pad, and the electrode B of each LED light-emitting chip is electrically connected to a corresponding B-electrode pad. In the same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other. In the same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of the same light emission color are electrically connected to each other.

LED display unit group and display panel

Provided is a LED backlight module, display screen and detection method of a LED backlight module. The LED backlight module includes a substrate and multiple LED chips arranged on the substrate, one first detection group is arranged on the substrate for each LED chip of more than one LED chip arranged at an interval of N LED chips connected in series, where N is greater than or equal to 0, the first detection group includes a first positive electrode detection point and a first negative electrode detection point, the first positive electrode detection point and the first negative electrode detection point of the first detection group are respectively connected to a positive electrode and a negative electrode of the each LED chip.

LED backlight module, display screen and detection method of LED backlight module

A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.

Chip-on-board display module, manufacturing method thereof, light-emitting diode device and manufacturing method thereof

Provided are an LED holder, an LED device and an LED display screen. The LED holder includes a metal frame and a cup cover wrapping the metal frame. The cup cover includes a reflective cup. The cup cover has a first lateral surface and a second lateral surface disposed opposite to each other. A height of the first lateral surface is greater than a height of the second lateral surface. The metal frame includes metal pins exposed outside the cup cover and disposed on the first lateral surface and/or the second lateral surface. The bottom of the cup cover is of a sloping structure, so that the light emitted by an LED chip in the reflective cup propagates along a specified direction.

LED holder, LED device and LED display screen

The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.

Light emitting diode device

An LED bracket, LED bracket array, LED device and LED display screen are disclosed. The LED bracket includes a PCB circuit substrate and an insulating material. The PCB circuit substrate includes at least two electrically insulated electrode regions. Each electrode region includes a top electrode region, a side electrode region and a bottom electrode region. The side electrode region connects the top electrode region and the bottom electrode region into an integrated structure. The side electrode region is a side surface sunk from outside to an inner part of the PCB circuit substrate. The insulating material is filled in the side electrode region. An upper end surface and a lower end surface of the insulating material do not exceed an upper surface and a lower surface of the PCB circuit substrate. A thickness of the insulating material is less than a thickness of the PCB circuit substrate.

LED bracket, LED bracket array, LED device and LED display screen

An LED device, a method for manufacturing an LED device, and an LED display module are provided. The LED device includes an LED bracket, an LED chip and an encapsulation sealant. The LED bracket includes a metal bracket and a cup cover encasing the metal bracket. The cup cover includes a reflective cup having a cavity. The LED chip is fixed in the cavity of the reflective cup. The cavity of the reflective cup is filled with the encapsulation sealant. The encapsulation sealant includes an under sealant and a surface sealant. The under sealant covers the LED chip, and the surface sealant covers the under sealant. The under sealant is a transparent layer. The surface sealant is a matte layer.

LED device, method for manufacturing an LED device, and LED display module

An LED bracket, an LED device and an LED display screen are disclosed. The LED bracket includes a metal bracket and a cup cover wrapping the metal bracket. The metal bracket includes a first metal pin embedded into the cup cover and a second metal pin exposed from the cup cover. A part, located on a top of the second metal pin, in the cup cover is a reflection cup. A light absorbing layer is disposed on a part of an outer side face of the reflection cup.

LED bracket, LED device and LED display screen

A light emitting diode (LED) support frame (), LED device adopting the same, and LED display module. The LED support frame () comprises a base board () and a reflection cup (). A light converging component () is arranged on the reflection cup (). A concave light converging surface () is provided at a side of the light converging component () and adjacent to a reflection cup mouth (). A part of a light beam emitted from an LED chip is directed to the light converging surface (), reflected by the light converging surface (), and finally converged with other light beams emitted from the LED chip to focus at a visual field observed by an observer. Therefore, the embodiment effectively reduces optical loss of lights from different directions in the light converging component ().

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Foshan, China

Chuanbiao Liu