Advanced Semiconductor Engineering, Inc.

Chuan-Yung Shih

Huang-Hsien Chang

Yuan-Feng Chiang

Tai-Yuan Huang

Chin-Feng Wang

Chun-Wei Shih

Yu-Chi Wang

Shao-Ci Huang

Sing-Syuan Shiau

In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.

Semiconductor package device and method of manufacturing the same

Growing community of inventors

Kaohsiung, Taiwan

Chuan-Yung Shih