Taiwan Semiconductor Manufacturing Comp. Ltd.

Chuan-Yi Ko

Jui-Chun Weng

Hsi-Cheng Hsu

Chih-Yu Wang

Shyh-Wei Cheng

Ji-Hong Chiang

Hsin-Yu Chen

Jong Chen

Chih-Shan Chen

Wei-Ding Wu

Chao-Po Lu

Chung-Hsien Hun

Chung-Hsien Hung

Chih-Hsien Chen

Yu-Mei Wu

The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.

Movement microelectromechanical systems (MEMS) package

Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.

Mechanism for forming MEMS device

Growing community of inventors

Hsinchu County, Taiwan

Chuan-Yi Ko