Dow Global Technolgoies LLC

Rohm and Haas Company

Chuan-Yar Lai

Xiaosong Wu

Cristina Serrat

Vivek Kalihari

Daniel W Himmelberger

Vinita Yadav

The present disclosure includes a composition that includes an ethylene/&#x3b1;-olefin random copolymer having density of 0.890 g/cmor less, a melting point of 100&#xb0; C. or less, and a melt index from 0.2 g/10 min to 8.0 g/10 min, a styrenic block copolymer comprising from 1 wt % to less than 50 wt % units of styrene, a tackifier, and an oil. The composition may exhibit an overall melt index of the composition of from 2 g/10 min to 15 g/10 min. The composition can be used as an adhesive in some embodiments. The present disclosure also includes multilayer films that include the composition, which may provide reclose functionality to the multilayer film. The multilayer films that include the composition may provide low initial opening force and improved reclose adhesion through multiple reclose cycles. The present disclosure also includes various types of reclosable packaging articles that include the multilayer films and adhesive compositions.

Growing community of inventors

Houston, TX, United States of America

Chuan-Yar Lai