Coretech System Co., Ltd.

Chuan-Wei Chang

Rong-Yeu Chang

Chia-Hsiang Hsu

Yuing Chang

Ching-Chang Chien

A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.

Method for setting molding conditions of injection-molding equipment

System for setting molding conditions of injection-molding equipment

The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.

Method for setting up a molding system

Display screen with a graphical user interface

The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.

A molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.

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Chupei, Taiwan

Chuan-Wei Chang