Industrial Technology Research Institute

Chuan-Sheng Zhuang

Ching-Chih Lin

Chun-Hao Chang

Wei-Chin Huang

Ji-Bin Horng

Guo-Shing Huang

Wen-Peng Tseng

Steven Lin

Wei-Lun Tai

Shih-Chieh Liao

Hui-Ta Chen

Ming-Hsien Ko

Chih-Hung Kao

Wei-Yu Chen

An apparatus of adjusting and controlling the stacking-up layer manufacturing comprises a target, a powder providing unit, an energy generating unit, and a magnetism unit. The powder providing unit is coupled on a top of the target. The energy generating unit is also coupled on the top of the target. The powder providing unit provides a powder to a surface of the target. The energy generating unit provides the energy beam to selectively heat the powder on the surface of the target to form a melted or sintered powder layer. The magnetism unit provides a magnetic field to control the solidification of the melted or sintered powder layer.

Apparatus and method for adjusting and controlling the stacking-up layer manufacturing

The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.

Device and method for powder distribution and additive manufacturing method using the same

A method for forming a parylene film is provided, which includes following steps. Providing a chemical vapor deposition apparatus including a buffer chamber having first and second valves and a rotative carrying apparatus, an evaporator connected with the second valve, a pyrolysis chamber connected with the evaporator, and a deposition chamber connected with the pyrolysis chamber. Placing a parylene material in the rotative carrying apparatus of the buffer chamber through the first valve. Turning off the first and second valves and balancing a pressure in the buffer chamber and a pressure in the evaporator. Turning on the second valve and delivering the parylene material into the evaporator. Evaporating the parylene material in the evaporator to form a parylene gas. Pyrolyzing the parylene gas in the pyrolysis chamber to form a parylene monomer. Delivering the parylene monomer to the deposition chamber for deposition so as to form a parylene film.

Method of forming parylene film

A method and an apparatus for inspecting radio frequency identification (RFID) tags which utilize a way of shielding for inspecting whether RFID tags function properly or not. The method of the present invention comprises steps of: reading a plurality of RFID tags in a readable zone; and determining whether there is any malfunctional RFID tag in the plurality of RFID tags. If all the plurality of RFID tags function properly, the method will check a next plurality of RFID tags. If there is at least one unreadable RFID tag, the at least one malfunctional RFID tag will be found by shielding one or the plurality of RFID tags. By means of the disclosure in the present invention, the present method and apparatus are capable of improving the efficiency during inspection and simplifying the design of a readable zone.

Method and apparatus for inspecting radio frequency identification tags

A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.

Wafer bonding method

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Taichung County, Taiwan

Chuan-Sheng Zhuang