Azurewave Technologies, Inc.

Chuan Jin

A flip-chip light-emitting module includes a main circuit board, a heat dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the heat dissipation substrate and a lens unit disposed in the frame. The frame includes a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive paths are electrically connected to the main circuit board. The light-emitting chip is disposed on a heat dissipation substrate including a top conductive contact and a light-emitting surface on the same side of the light-emitting chip. The top conductive contact is electrically connected to the first conductive path through a conductor. The lens unit is provided with at least one light-transmitting conductive layer electrically connected to the at least two second conductive paths.

Flip-chip light-emitting module

The present invention provides an image capturing module and a portable electronic device, including a circuit substrate, an image sensing chip, a filter element, and a lens assembly. The upper surface of the circuit substrate includes a chip placing area, a first solder area, and a second solder area. The upper surface of the image sensing chip includes an image sensing area, a carrier area, a first conductive area, and a second conductive area, and the carrier area surrounds the image sensing area. The lower surface of the filter element has a light transmitting area and a connecting area surrounding the light transmitting area. The first conductive area and the second conductive area of the image sensing chip are electrically and respectively connected to the first solder area and the second solder area of the circuit substrate.

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Hubei, China

Chuan Jin