Taiwan Semiconductor Manufacturing Comp. Ltd.

Chuan-Hsiang Sun

Chi-Chang Lai

Hsiou-Yu He

Bo-You Chen

Peiwei Lin

Chen-Shien Chen

Mill-Jer Wang

Hao Chen

Wen-Yi Lin

Chien-Chen Li

An apparatus for probing a device-under-test (DUT) includes a fixture, a circuitry film attached to the fixture, a probing tip disposed on and electrically coupled to the circuitry film to probe a device-under-test, and a first signal connector disposed on the circuitry film and electrically coupled to the probing tip through the circuitry film. The first signal connector is oriented in a direction that is angularly offset from a lengthwise direction of the probing tip.

Apparatus for probing device-under-test

A probe head structure is provided. The probe head structure includes a flexible substrate having a top surface and a bottom surface. The probe head structure includes a first probe pillar passing through the flexible substrate. The first probe pillar has a first protruding portion protruding from the bottom surface. The probe head structure includes a redistribution structure on the top surface of the flexible substrate and the first probe pillar. The redistribution structure is in direct contact with the flexible substrate and the first probe pillar. The redistribution structure includes a dielectric structure and a wiring structure in the dielectric structure. The wiring structure is electrically connected to the first probe pillar. The probe head structure includes a wiring substrate over the redistribution structure. The probe head structure includes a first conductive bump connected between the wiring substrate and the redistribution structure.

Method for forming probe head structure

An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.

Apparatus and method for probing device-under-test

Growing community of inventors

Taoyuan, Taiwan

Chuan-Hsiang Sun