Delta Electronics, Inc.

Chuan-Chia Cheng

Hsueh-Kuo Liao

Shih-Peng Chen

Ching-Chuan Shiue

Huang-Kun Chen

Kai-Ti Chang

Shao-Chuan Chen

Hung-Yen Chan

A package structure of a power module is provided. The package structure includes a body having a sidewall, a first protruding structure protruding outward from one end of the sidewall, a second protruding structure protruding outward from another end of the sidewall and opposite to the first protruding structure, and a spring having two ends embedded in the first and the second protruding structures, respectively. The stress is transferred to the first and the second protruding structures via the spring, respectively. The equivalent stiffness of the spring is different from that of the body so that the package structure as a whole suffers the stress uniformly.

Package structure of power module

An electroluminescent device includes a conduction substrate, a reflection layer, a patterned transparent conduction layer, at least one light emitting diode (LED) element, a first contact electrode and a second contact electrode. The reflection layer is disposed on the conduction substrate, and the patterned transparent conduction layer is formed on the reflection layer. The LED element is formed on the patterned transparent conduction layer, and the LED element includes a first semiconductor layer, a light emitting layer and a second semiconductor layer in sequence. The second semiconductor layer is disposed on the patterned transparent conduction layer and the reflection layer. The first contact electrode is disposed at one side of the first semiconductor layer, and the second contact electrode is disposed at one side of the conduction substrate.

Electroluminescent device

Electroluminescent device and fabrication method thereof

Growing community of inventors

Taoyuan Hsien, Taiwan

Chuan-Chia Cheng