Mediatek Corporation

Chu-Wei Hu

Yuan-Hung Chung

Yuan-Fu Chung

Tien-Yu Lu

Hsin-Hsin Hsiao

Chien-Chih Lin

Chih-Chung Chiu

Zheng Zeng

Cheng Hua Lin

Sheng-Hung Fan

Wei-Li Tsao

A semiconductor package includes a first substrate, a second substrate, a conductive component, an electronic component and a passive component. The conductive component is disposed between the first substrate and the second substrate, wherein the first substrate and the second substrate are separated from each other by an interval. The electronic component and the passive component are disposed within the interval.

Semiconductor package

A semiconductor device capable of high-voltage operation includes a semiconductor substrate having a first conductivity type. A first well doped region is formed in the semiconductor substrate, having a second conductivity type that is the opposite of the first conductivity type. A first doped region and a second doped region are formed on the first well doped region, having the second conductivity type. A first gate structure is formed over the first well doped region and adjacent to the first doped region. A second gate structure overlaps the first gate structure and the first well doped region. A third gate structure is formed beside the second gate structure and close to the second doped region. The top surface of the first well doped region between the second gate structure and the third gate structure avoids having any gate structure and silicide formed thereon.

Semiconductor device capable of high-voltage operation

An integrated circuit includes a first polysilicon region having a first grain size formed on a substrate. The integrated circuit also includes a second polysilicon region, having a second grain size different from the first grain size, formed on the substrate. The first polysilicon region is doped with a first dopant of a first conductive type and a second dopant selected from elements of group IIIA and group IVA which has an atomic weight heavier than that of silicon.

Integrated circuits and fabrication methods thereof

A method of fabricating an integrated circuit is also provided. The method includes forming a first polysilicon region having an initial grain size on a substrate. The first polysilicon region is implanted with a first dopant of a first conductivity type and a second dopant. After the implantation, the first polysilicon region has a first grain size larger than the initial grain size. Then, a laser rapid thermal annealing process is performed to the first polysilicon region.

An integrated circuit includes a first polysilicon region having a first grain size formed on a substrate. The integrated circuit also includes a second polysilicon region, having a second grain size different from the first grain size, formed on the substrate. Furthermore, a method of fabricating an integrated circuit is also provided. The method includes forming a first polysilicon region having an initial grain size on a substrate. The first polysilicon region is implanted with a first dopant of a first conductivity type and a second dopant. After the implantation, the first polysilicon region has a first grain size larger than the initial grain size. Then, a laser rapid thermal annealing process is performed to the first polysilicon region.

In accordance with one embodiment, the present invention provides a bipolar junction transistor including an emitter region; a base region; a first isolation between the emitter region and the base region; a gate on the first isolation region and overlapping at least a portion of a periphery of the emitter region; a collector region; and a second isolation between the base region and the collector region.

Growing community of inventors

Zhubei, Taiwan

Chu-Wei Hu