Intel Corporation

Chu Aun Lim

Kok Hong Chan

Tark Wooi Fong

Jackson Chung Peng Kong

Min Suet Lim

Eng Huat Goh

Ping Ping Ooi

Poh Tat Oh

Fern Nee Tan

Khai Ern See

Jenn Chuan Cheng

Jimmy Huat Since Huang

Teong Keat Beh

Damien Weng Kong Chong

Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.

Apparatus utilizing computer on package construction

An apparatus including a circuit substrate having a plurality of contactor pins extending between two opposing surfaces; and at least one capacitor mounted on one of the two opposing surfaces of the circuit substrate.

Method and apparatus for testing electronic devices

An apparatus for testing electronic devices such as integrated circuits. In one embodiment, an apparatus for testing electronic devices is disclosed that includes a housing such as a test contactor housing which has a plurality of test contactor pins that extend therethrough. The plurality of test contactor pins include a first set of power pins, a second set of ground pins, and a third set of signal pins. A printed circuit board, attached to the housing, has a first ground plane and a first power plane. The power pins are electrically coupled to the first power plane and the ground pins are electrically coupled to the first ground plane. The first set of power pins, the second set of ground pins, and the third set of signal pins extend through the printed circuit board.

Growing community of inventors

Penang, Malaysia

Chu Aun Lim