Bae Systems Information and Electronic Systems Integration Inc.

Christy A Hagerty

Keith K Sturcken

John A Hughes

Santos H Nazario-Camacho

Thomas J McIntyre

A method for fabricating an electronic device package having a column grid array is disclosed. A column grid array package includes a substrate, an integrated circuit located on a first side of the substrate, and a set of solder columns located on a second side of the substrate. The column grid array package also includes multiple two-tab electronic devices located on the second side of the substrate. The heights of the two-tab electronic devices are substantially identical to the heights of the solder columns.

Method for fabricating solder columns for a column grid array package

An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate. The non-uniformity of length in the wire columns reduces stress in the package leads after attachment of the package to a carrier substrate, such as a printed circuit board.

Growing community of inventors

Haymarket, VA, United States of America

Christy A Hagerty