Finisar Corporation

Christopher William Johnson

Jose Joaquin Aizpuru

Bobby Marion Hawkins

Jack Gilkerson

Mansour Jannati

Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.

Reducing thermal expansion effects in semiconductor packages

The present invention relates to affixing components of optical packages. The optical packages can include an optical component, such as a TO-Can. The TO-Can can house an optical transmitter and/or an optical receiver. Another optical component of the optical package can be a barrel for aligning the TO-Can with an optical fiber. The TO-Can can be affixed within an open end of the optical barrel using a bonding substance, such as an epoxy, that has wicking properties. The wicking properties cause the bonding substance to enter a gap between the optical barrel and the TO-Can by capillary action. Use of the bonding substance with wicking properties creates a more robust optical package in a cost effective manner.

Securing a transistor outline can within an optical component

A cure oven comprises a sealable door and one or more pressure valves mounted inside for curing optical subcomponents that have been assembled using an adhesive. The cure oven comprises a chamber that can be configured to receive several hundreds of assembled optical subcomponents. The cure oven is further coupled to a computerized system via a drive motor. The computerized system initiates the heating and cooling sequences, and indicates whether the door can be opened, or must remain shut. The cure oven maintains a certain pressure inside the oven chamber consistent with a rise in temperature, allowing assembled optical subcomponents to be cured at a much higher rate than possible without disassembling, or being damaged.

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Saschey, TX, United States of America

Christopher William Johnson