Intel Corporation

Christopher Wade Ackerman

Michael L Rutigliano

James C Shipley

Christopher Roy Schroeder

Ioan Sauciuc

James G Maveety

Ashish Gupta

Paul J Diglio

Joseph B Petrini

Tolga Acikalin

Craig Yost

John C Johnson

Edvin Cetegen

Thomas A Boyd

Kuang C Liu

Kelly P Lofgreen

Bijoyraj Sahu

Todd R Coons

Craig J Jahne

Nader N Abazarnia

Minh T Le

Morten S Jensen

Akhilesh P Rallabandi

Evan A Chenelly

Carlos Alvizo Flores

James R Hastings

Kelly Lofgreen

Victor Henckel

Mahesh J Deshmane

David Won-jun Song

Shoujie He

Jacob Hales

Joseph Zearing

Jensen Stenberg

Varun Narayan

Sami Alelyani

Ruben Nunez Blanco

Anthony Yeh Chiing Wong

Boon Liang Heng

Yang Jiao

Johnny Mata Vega

This disclosure describes systems, methods, and devices related to preventing water leakage from jet impingement applied to an integrated circuit under test. An integrated circuit testing apparatus for applying jet impingement to an integrated circuit may include an impingement chamber in contact with an integrated circuit being tested, the impingement chamber comprising water associated with cooling the integrated circuit; and an actuator-driven thermal management block including an air inlet configured to direct a flow of air into an immediate test environment for the integrated circuit to generate a positive pressure differential with respect to the water in the impingement chamber to prevent leakage of the water from the impingement chamber.

Enhanced jet impingement leak prevention for integrated circuit

The present disclosure is directed to a system having a first loading component and a second loading component for applying load to a device during a test of the device, the first loading component is configured to be moveable with respect to the second loading component. The system includes a seal member arranged between the first loading component and the second loading component, the seal member is adapted to engage the device during testing so as to apply a load against the device during testing and provide sealing around a cavity positioned below the first loading component and above the device.

System and apparatus having a seal member for sealing of a device under test

An apparatus includes a processor configured to control an automatic test equipment (ATE) to measure one or more parameters of a current test instance for testing a device under test (DUT), during execution of the current test instance on the DUT, and determine, based on the measured one or more parameters, one or more controls for controlling a temperature of a thermal head connected to the DUT so that a junction temperature of the DUT corresponds to a predetermined test temperature. The processor is further configured to control the temperature of the thermal head, based on the determined one or more controls.

Apparatus and method for controlling unit specific junction temperature with high temporal resolution for concurrent central processing unit (CPU) core testing

A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

Conformable heat sink interface with a high thermal conductivity

Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Modular thermal energy management designs for data center computing

Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

System for thermal management of device under test (DUT)

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.

Active thermal control using a burn-in socket heating element

Growing community of inventors

Phoenix, AZ, United States of America

Christopher Wade Ackerman