International Business Machines Corporation

Christopher W Cline

Roy Rongqing Yu

Edward John Yarmchuk

Thomas Anthony Wassick

Chandrika Prasad

Michael E Scaman

Arnold Halperin

Robert Stephen Olyha, Jr

Donald Merte

Charles J Hendricks

Thomas Picunko

Brian J Wojszynski

Nancy Wagner Hannon

Vincent A Arena

A method and apparatus for the non-contact electrical test of both opens and shorts in electronic substrates. Top surface electrical test features are exposed to an ionization source under ambient conditions and the subsequent charge build up is measured as a drain current by probes contacting corresponding bottom surface features. Opens are detected by an absence of a drain current and shorts are detected by turning off the ionization source and re-measuring the bottom surface probes with a varying bias applied to each probe in the array.

Ionization test for electrical verification

A method and structure for providing top-to-bottom repair of a defective I/O net in a thin film transfer and join process. At least one C,location and at least one capture pad are provided on a thin film substrate. The substrate is preferably ceramic. The C,location of the defective net is severed by removal of a delete strap. The corresponding solder connection of the associated capture pad is also removed. A spare C,location and capture pad are connected to provide a Z-repair line imbedded in the TF wiring structure. The Z-repair line is wired to the defective net.

Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join process

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Hopewell Junction, NY, United States of America

Christopher W Cline