International Business Machines Corporation

Globalfoundries Inc.

Infineon Technologies Ag

Information Business Machines Corporation

Perraud, Laurent Claude

Christopher Vincent Jahnes

Anthony K Stamper

Alfred Grill

John Michael Cotte

Katherine Lynn Saenger

Vishnubhai Vitthalbhai Patel

Eric Jeffrey White

Sampath Purushothaman

William Joseph Murphy

Jeffrey C Maling

Timothy Joseph Dalton

Hariklia Deligianni

Kevin Shawn Petrarca

Richard Paul Volant

Xiao Hu Liu

Alessandro Cesare Callegari

Daniel C Edelstein

Fuad Elias Doany

Jeffrey Curtis Hedrick

Robert Allen Groves

Panayotis Constantinou Andricacos

Katherina E Babich

James Patrick Doyle

Cyprian Emeka Uzoh

Evan G Colgan

Paul Alfred Lauro

Bucknell Chapman Webb

Gareth Geoffrey Hougham

Satyanarayana Venkata Nitta

S Jay Chey

John Harold Magerlein

John Patrick Hummel

Nancy C LaBianca

Cyril Cabral, Jr

Alexander V Rylyakov

Stephen Mark Rossnagel

Chandrasekhar Narayan

Robert L Wisnieff

Clint Lee Schow

Paul David Agnello

David Earle Seeger

Ronnen Andrew Roy

Mehmet Soyuer

John Ulrich Knickerbocker

Kevin K Chan

Ping-Chuan Wang

Timothy Dooling Sullivan

Russell Alan Budd

Duixian Liu

Jane M Shaw

George Frederick Walker

Solomon Assefa

Minhua Lu

Brian Paul Gaucher

Bruce Kenneth Furman

Mahadevaiyer Krishnan

James L Speidell

Stanislav Polonsky

Lawrence E Larson

Benjamin G Lee

Kenneth Jay Stein

Hongbo Peng

Roy Arthur Carruthers

Chirag Suryakant Patel

Tien-Jen Cheng

Stephan Alan Cohen

Robert J Baseman

Jingwei Bai

Stanley Joseph Whitehair

Mohammad Taghi Mirzamaani

Cornelia Kang-I Tsang

Carl John Radens

Michael S Gordon

Igor Y Khandros

Zhong-Xiang He

Kenneth Parker Rodbell

Alejandro Gabriel Schrott

Paul Stephen Andry

Sri Muthuthamby Sri-Jayantha

Wayne Martin Moreau

Jeffrey F Roeder

Robert J Von Gutfeld

Eric Andrew Joseph

Hiroyuki Miyazoe

Vincent James McGahay

Yurii A Vlasov

Richard Joseph Gambino

Jonathan Zanhong Sun

Arun Sharma

Leathen Shi

Praveen Chaudhari

Kenneth John McCullough

Shui-Chih Alan Lien

John Patrick Simons

James Andrew Lacey

Madhav Datta

James Harvey Kaufman

Gregory Costrini

Frances Anne Houle

David R Greenberg

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

Micro-electro-mechanical system (MEMS) structures and design structures

A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

Planar cavity MEMS and related structures, methods of manufacture and design structures

A MEMS device comprises an electro mechanical element in a sealed chamber containing a gas comprising a reactive gas selected to react with any contaminants that may be present or formed on the operating surfaces of the device in a manner to maximize the electrical conductivity of the surfaces during operation of the device. The MEMS device may comprise a MEMS switch having electrical contacts as the operating surfaces. The reactive gas may comprise hydrogen or an azane, optionally mixed with an inert gas, or any combination of the gases. The corresponding process provides a means to substantially reduce or eliminate contaminants present or formed on the operating surfaces of MEMS devices in a manner to maximize the electrical conductivity of the surfaces during operation of the devices.

Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both metal material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

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Upper Saddle River, NJ, United States of America

Christopher Vincent Jahnes