Medtronic, Inc.

Christopher T Kinsey

Andrew J Ries

Mark E Henschel

Robert A Munoz

David A Ruben

Chunho Kim

Jeffrey S Voss

Kris A Peterson

Andreas A Fenner

Scott B Sleeper

Jeffrey L Galvin

Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

Hermetic assembly and device including same

Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

Feedthrough assembly and device including same

In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

Electronics assembly for implantable medical device

A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.

Laser bonding tool with improved bonding accuracy

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Gilbert, AZ, United States of America

Christopher T Kinsey