Metis Design Corporation

The Boeing Company

Other

Analog Devices,inc.

Christopher T Dunn

Seth S Kessler

Michael Borgen

Brian Lee Wardle

Gregory A Thomas

Yosef Stein

Jeong-Beom Ihn

Jeffrey Lynn Duce

Dong-Jin Shim

Kristin A Jugenheimer

Hazarathaiah Malepati

Aaron B Size

Armindo B Chaves

Joshua F Kessler

Sophie T Berk

Michael G Borgen

A multifunctional assembly having a resistive element a conductive element in electrical communication with the resistive element, the conductive element defining at least one of a plurality of multifunctional zones of the resistive element, wherein the conductive element is configured to direct a flow of electricity across at least one of the plurality of multifunctional zones of the resistive element in a preselected manner.

Multifunctional assemblies

Systems and methods are provided for a distributed mufti-sensor witness integrity sensing platform (WISP) approach which allows for positioning of sensors in an enclosed space. In particular, a WISP platform is divided into two modules, with a base module is connected to multiple edge sensor modules with a wired connection. In general, splitting up the distributed WISP system described herein allows multiple sensors to be placed in an enclosed (and generally inaccessible) location. The sensor data can be transmitted from the multiple edge sensor modules via a connection to the base module. Additionally, the use of the two module system as provided herein allows the sensors to be positioned meters away from the first module.

Distributed witness integrity sensing platform

Systems and methods for in-situ monitoring of gearbox are provided. An example system includes a mounting plate coupled to a component within the gearbox and a transducer array having a plurality of piezoelectric transducers disposed thereon to ultrasonically obtain diagnostic information about one or more components in the gearbox. The plurality of piezoelectric transducers are in contact with a surface of one or more mechanical components within the gearbox. The system includes circuitry, at least a portion of which is mounted inside the gearbox, electrically couplable to the transducer array, the circuitry configured to direct an excitation signal to a selected piezoelectric transducer of the plurality of piezoelectric transducers, and direct a response received from one or more of the plurality of piezoelectric transducers in proximity to the selected piezoelectric transducer toward a processor programmed or configured to determine gearbox diagnostic information therefrom.

Systems and methods for in-situ monitoring of gearbox

Exemplary embodiments are directed to instrumented fasteners and associated damage detection systems for detecting damage in an assembled structure secured together by at least one instrumented fastener. The instrumented fastener forms a transducer assembly for detecting damage in the assembled structure. The fastener can include a cavity disposed at one end of the fastener. The transducer assembly includes an electromechanical unit at least partially inserted into and mechanically coupled within the cavity of the fastener. The electromechanical unit can include a piezoelectric element.

Damage detection system and method for detecting damage in fastened structures

Corrosion sensors are described. The corrosion sensors may include components formed from carbon nanotube structures and a corroding element formed of a material which corrodes more quickly than a target material being monitored by the corrosion sensor. The corroding material may be exposed to the environment to which the target material being monitored is exposed. The corrosion sensor may be passive, thus consuming little power.

Disposable witness corrosion sensor

Devices and methods described herein provide electrode pair access from a single side of a device by using one or more via holes through the device. The via hole can pass through or near the center of the device. By creating a conductive path through the via hole of the device, devices and methods of the present disclosure advantageously provide access to a pair of electrodes, each of which contacts a different side of a device layer, on a single side of the device while enabling a greater active device area than is possible using conventional techniques. In addition, the central location of the via hole provides favorable mechanical properties by avoiding radial constriction of the device layers in applications such as piezoelectric devices.

Electrical via providing electrode pair access on a single side of a device

Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular system includes a digitizing sensor node. The system further includes a bus including a plurality of conductive elements applied to a substrate. A first conductive element of the bus is coupled to the digitizing sensor node using a direct-write technique.

Digitizing sensors coupled to a structure

Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular method includes applying one or more communication traces and one or more power traces to a structure using at least one direct-write technique. The method may also include coupling the one or more communication traces to at least one digitizing sensor. The method may also include coupling the one or more power traces to the at least one digitizing sensor.

Method of coupling digitizing sensors to a structure

A method of detecting an event in a structure using a device having sensors and at least one actuator includes sending a signal from the at least one actuator encapsulated in the device, returning a reflected wave signal from the event to each of the sensors in the device, determining a respective duration of time for which the signal travels from the event to each of the sensors, and calculating a location of the event by using differences in the respective durations of time for which the signal travels from the event to each of the sensors to determine an angle and a distance at which the event is positioned.

Triangulation with co-located sensors

A device for use in detecting structural damage includes at least one piezoelectric wafer that has a sensor, and an actuator in-plane with the sensor. At least one of the sensor and the actuator at least partially surrounds the other of the sensor and the actuator such that the piezoelectric wafer provides radial detection of structural occurrences in a material.

Growing community of inventors

Salem, MA, United States of America

Christopher T Dunn