Nptest, Inc.

Christopher Shaw

Theodore R Lundquist

Chun-Cheng Tsao

Methods for integrated circuit diagnosis, characterization or modification using a charged particle beam. In one implementation, the bulk silicon substrate of an integrated circuit is thinned to about 1 to 3 &#x3bc;m from the deepest well, a voltage is applied to a circuit element that is beneath the outer surface of the thinned substrate. The applied voltage induces an electrical potential on the outer surface, which is detected as a surface feature on the outer surface by its interaction with the charged particle beam.

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Mountain View, CA, United States of America

Christopher Shaw