Parker-hannifin Corporation

Christopher Severance

Douglas Nobbs

William G Lionetta

Daniel S Ventura

Jonathan Bergin

Louis M Yantosca, Jr

Robert E Stiffler

David C Rich

Victoria Santa Fe

Gary Rosa

John D Reynolds

A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.

Thermally conductive foam product

An EMI shielding material is provided for making EMI shielding gaskets, coating and other articles. The EMI shielding material includes a non-conductive polymer, an inherently conductive polymer and a conductive metal powder. These components are intimately combined to prepare EMI shielding materials having superior electrical and mechanical performance when used in applications such as housings for electronic components.

Composite polymeric material for EMI shielding

An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a first material such as a thin metal sheet or screen, or a metal-plated fabric or other electrically-conductive mesh, and a second member formed of a second material different than the first material which second material is an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.

Composite EMI shield

Growing community of inventors

Derry, NH, United States of America

Christopher Severance