Amkor Technology, Inc.

Christopher Scanlan

Jeffrey Alan Miks

Mahmoud Dreiza

Jong Ok Chun

August Joseph Miller, Jr

Ruben Fuentes

A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.

System and method for RF shielding of a semiconductor package

A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.

Thermal via heat spreader package and method

A semiconductor package has a first substrate having a plurality of metal traces. At least one die is electrically coupled to the first surface of the first substrate. A plurality of land pads is formed on the first surface of the first substrate. A mold compound encapsulates portions of the die and portions of the first surface of the first substrate. A conductive coating is applied to the mold compound and electrically coupled to at least one metal trace. A non-conductive coating is formed over the conductive coating and portions of the mold compound. A plurality of vias is formed through the non-conductive coating and the mold compound to expose the land pads.

Growing community of inventors

Hellerup, Denmark

Christopher Scanlan