Innovative Micro Technology

Silicon Light Machines Corporation

Kovio, Inc.

International Business Machines Corporation

Thin Film Electronics Asa

Other

Seagate Technology Incorporated

Johnson and Johnson Vision Care, Inc.

Censtor Corporation

Kovlo, Inc.

Christopher S Gudeman

James A Hunter

J Devin MacKenzie

Joerg Rockenberger

Paul Rubel

James Montague Cleeves

John Stuart Foster

David T Amm

Fabio R Zurcher

Criswell Choi

Vik Pavate

Max Davis

Dan Good

Alexander P Payne

Gregory A Carlson

Jaquelin K Spong

David Thomas Amm

Gerard H Vurens

Jahja I Trisnadi

Dinesh Maheshwari

Keith R Berding

John S Foster

Harold J Hamilton

Jeffery Frank Summers

Steven H Hovey

Michael A Baldwinson

Marin Sigurdson

Michael H Azarian

Li-Ju J Lin

Michael W Bruner

Jose Arreola

Richard Yeh

Garrett A Garrettson

J Montague Cleeves

Kaynam Chun

Clinton Carroll

Steven W Meeks

Omar Sze Leung

Patrick Smith

Andrew Ching Tam

Peter Michael Baumgart

Thao Anh Nguyen

Vikram Pavate

Mark A Lauer

Stephen Robert Beaton

Alfred Floyd Renaldo

Dimitre A Latev

Robert D Hempstead

Bret A Coldren

Alok Paranjpye

Jason Tokarski

Douglas L Thompson

Brian N Hubert

Michael Ferran

Douglas J Krajnovich

Ian R Johnston

Jim Hunter

Suresh Sampath

Fior D Sargent

Abbaspour Tamijani

Partick Smith

Prosenjit Sen

Shinichi M Tanaka

Anthony A Jarrami

Abbas Abbaspour Tamijani

Justin Scott Jacobs

Fardad Chamran

J Devin Mackenzie

Systems and methods for forming a magnetostatic MEMS switch include forming a movable beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A shunt bar on the movable plate may close the switch when lowered onto the contacts. The switch may generally be closed, with the shunt bar resting on the contacts. However, a magnetically permeable material may also be inlaid into the movable plate. The switch may then be opened by placing either a permanent magnet or an electromagnet in proximity to the switch.

MEMS dual substrate switch with magnetic actuation

A microfabricated spectrometer uses at least one filter to discriminate the frequency components of an incoming RF signal. The filter center frequencies are chosen to correspond to wavelengths of target species which may be present in the gas, and radiating at a characteristic frequency.

Subterahertz microfabricated spectrometer

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.

Eight spring dual substrate MEMS plate switch and method of manufacture

Systems and methods for forming a mm wave resonant filter include a lithographically fabricated high Q resonant structure. The resonant structure may include a plurality of cavities, each cavity having a characteristic frequency that defines its passband. A filter may include a plurality of resonant structures, and each resonant structure may include a plurality of cavities. These cavities and filters may be fabricated lithographically.

Resonant filter using mm wave cavity

A microfabricated RF filter uses a resonant cavity weakly coupled to a transmission line, to attenuate noise sources emitting interference into the RF radiation at the resonant frequency. Radiation at the resonant frequency is leaked into the resonant cavity and build up there, until it is dumped to ground by a switch.

Microfabricated notch filter

Systems and methods for forming a compact gas sensor include a multilayer etalon as a wavelength discriminating element. The position of the etalon may be adjusted to tune its transmission profile. And embodiment directed to carbon dioxide detection is described.

Gas sensor comprising a rotatable Fabry-Perot multilayer etalon

Systems and methods for forming a compact gas sensor include using a lithographically fabricated high Q resonator coupled to at least one of a Gunn diode and an IMPATT diode. The resonator may include a plurality of cavities filled with a sample gas. A detector coupled to the resonator may measure the amplitude of the emitted mm wave radiation.

Gas sensor using mm wave cavity

A method for forming electrical contacts on a semiconductor substrate is disclosed. The method includes forming a first metal layer over the substrate, and forming a layer of a second metal oxide by sputter deposition of a second metal in an oxygen environment. In some embodiments, the second metal oxide may be ruthenium dioxide, and the first metal layer may be gold, copper, platinum, silver or aluminum.

Contact material for MEMS devices

Described here is a platform for supporting a fiber optic cable. The platform may be made on a silicon wafer using silicon lithographic processing techniques. The platform may include a substrate having a top planar surface; a trench formed in the substrate in the top planar surface and dimensioned to accept a fiber optic cable carrying radiation; and a reflecting surface formed in the top planar surface, wherein this reflecting surface is configured to reflect the radiation by total internal reflection, wherein the reflecting surface is configured to direct radiation travelling in a first direction into a second direction, substantially orthogonal to the first direction.

Microfabricated fiber optic platform

A transceiver and interconnect for connecting a plurality of optical cables. In one embodiment, optical sources are joined to a plurality of fiber optic output cables. The structures may use a plurality of ball lenses to collimate the diverging light from the source and launch it down one of the plurality of fibers. Through holes in a silicon substrate may allow the radiation to pass, and these features may be made very precisely.

Self-aligned silicon fiber optic connector

A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.

Microfabricated optical apparatus with grounded metal layer

A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.

Thermocompression bonding with raised feature

Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.

Dual substrate electrostatic MEMS switch with multiple hinges and method of manufacture

Described herein is a method and structure for fabricating vias in a semiconductor substrate. The semiconductor substrate is first doped to make it mildly conducting, via holes are formed therein, and a conductive material is deposited in the holes. Using the moderate conductivity of the substrate, the conductive material may be plated into the holes.

Method for making vias using a doped substrate

Growing community of inventors

Lompoc, CA, United States of America

Christopher S Gudeman