Intel Corporation

Christopher S Baldwin

Mark B Trobough

Hongbo Li

James R Dunphy

Domino Taverner

Paul Lefebvre

Andre R Vincelette

Ravindranath Vithal Mahajan

Rajasekaran Swaminathan

Yidnekachew S Mekonnen

Robert Bryce Johnson

Kemel Aygun

A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.

Multiple die package using an embedded bridge connecting dies

Object slinging device

In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.

Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates

Growing community of inventors

Chandler, AZ, United States of America

Christopher S Baldwin