Infineon Technologies Ag

Christopher Roemmelmayer

Goran Keser

Jens Barrenscheen

Tomas Manuel Reiter

Radovan Vuletic

Guenter Schwarzberger

Pawan Garg

Mathias Kiele-Dunsche

Christoph Grund

Felix Kaiser

Maximilian Burggraf

Methods and devices for detecting electrical arcs are provided. A first wavelet transformation with a first mother wavelet is applied to a chronological sequence of current measurements () of a current through a lead, to obtain first wavelet coefficients. In addition, a second wavelet transformation with a second mother wavelet different from the first mother wavelet is applied to the chronological sequence in order to obtain second wavelet coefficients. On the basis of the first wavelet coefficients and the second wavelet coefficients, it is then determined whether an arc () is present.

Methods and devices for detecting an electrical arc

An apparatus for driving a motor includes motor circuitry and neural network circuitry. The motor circuitry is configured to generate, based on an error compensated rotor angle and current at a plurality of phases of the motor, a d-axis instant current value and generate a d-axis instant voltage value based on the d-axis instant current value. The motor circuitry is further configured to generate voltage at the plurality of phases based on the d-axis instant voltage value. The neural network circuitry is configured to generate a rotor angle offset based on an instant rotor speed at the motor. The neural network circuitry has been trained to generate the rotor angle offset to minimize the d-axis instant voltage value for each of a plurality of rotor speeds at the motor. The error compensated rotor angle is based on the rotor angle offset.

Rotor angle error compensation for motors

A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.

Semiconductor module with package extension frames

A controller circuit for a brushless direct current (BLDC) motor may be configured to estimate a rotor position of the BLDC motor and apply a constant start-up voltage to a stator winding of the BLDC motor using the estimated rotor position until a current at the stator winding corresponds to a local minimum current. The controller circuit may be further configured to, in response to the current at the stator winding corresponding to the local minimum current, allow commutation of the current at the stator winding, calculate the rotor position in response to allowing the commutation of the current at the stator winding, and commutate the current at the stator winding using the calculated rotor position.

Sensorless motor control

Techniques for monitoring an internal pressure of a battery cell, whereby a membrane that is part of an outer shell of the battery cell is used as an element of capacitive-based or inductive-based sensor circuitry in order to measure a change of capacitance or inductance under deformation of the membrane from the internal pressure of the battery cell. The change of capacitance or inductance may in turn be used to derive a value for the internal pressure of the battery cell.

Growing community of inventors

Munich, Germany

Christopher Roemmelmayer