Growing community of inventors

Oakland, CA, United States of America

Christopher Robin Thewalt

Average Co-Inventor Count = 3.18

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 436

Christopher Robin ThewaltJerry Samuel Dimsdale (4 patents)Christopher Robin ThewaltBen K Kacyra (4 patents)Christopher Robin ThewaltMark Damon Wheeler (2 patents)Christopher Robin ThewaltJonathan Apollo Kung (2 patents)Christopher Robin ThewaltGregory Charles Walsh (1 patent)Christopher Robin ThewaltRichard William Bukowski (1 patent)Christopher Robin ThewaltDimitrios Ioannou (1 patent)Christopher Robin ThewaltMark Brunkhart (1 patent)Christopher Robin ThewaltYuelin Chen (1 patent)Christopher Robin ThewaltChristopher Robin Thewalt (7 patents)Jerry Samuel DimsdaleJerry Samuel Dimsdale (26 patents)Ben K KacyraBen K Kacyra (9 patents)Mark Damon WheelerMark Damon Wheeler (69 patents)Jonathan Apollo KungJonathan Apollo Kung (12 patents)Gregory Charles WalshGregory Charles Walsh (19 patents)Richard William BukowskiRichard William Bukowski (11 patents)Dimitrios IoannouDimitrios Ioannou (4 patents)Mark BrunkhartMark Brunkhart (4 patents)Yuelin ChenYuelin Chen (1 patent)
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Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Leica Geosystems Hds, Inc. (3 from 10 patents)

2. Leica Geosystems Ag (2 from 457 patents)

3. Cyra Technologies, Inc. (2 from 11 patents)


7 patents:

1. 9832487 - Model-based scan line encoder

2. 7990397 - Image-mapped point cloud with ability to accurately represent point coordinates

3. 7313506 - Advanced applications for 3-D autoscanning LIDAR system

4. 6804380 - System and method for acquiring tie-point location information on a structure

5. 6781683 - Advance applications for 3-D autoscanning LIDAR system

6. 6619406 - Advanced applications for 3-D autoscanning LIDAR system

7. 6473079 - Integrated system for quickly and accurately imaging and modeling three-dimensional objects

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as of
12/27/2025
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