Other

Renishaw Plc

The University of Bath

Christopher Rhys Bowen

Timothy Peter Mollart

Wang Nang Wang

Michael John Edwards

Quanzhong Jiang

Irene Gladys Turner

Daniel Zabek

Vincent Ayel

Yves Bertin

Cyril Romestant

Duncan Allsopp

Ruggero Gabbrielli

Emanuele Magalini

An apparatus for generating electrical energy comprises an oscillating heat pipe for transferring heat between a heat source and a heat sink, and a pyroelectric generator for generating electricity from thermal fluctuations generated by the oscillating heat pipe as the oscillating heat pipe transfers heat between the heat source and the heat sink.

Apparatus and method for generating electrical energy

A method of fabricating a composite semiconductor component comprising: (i) providing a bowed substrate comprising a wafer of synthetic diamond material having a thickness t, the bowed substrate being bowed by an amount B and comprising a convex face and a concave face; (ii) growing a layer of compound semiconductor material on the convex face of the bowed substrate via a chemical vapour deposition technique at a growth temperature T to form a bowed composite semiconductor component comprising the layer of compound semiconductor material of thickness ton the convex face of the bowed substrate, the compound semiconductor material having a higher average thermal expansion coefficient than the synthetic diamond material between the growth temperature T and room temperature providing a thermal expansion mismatch &#x394;T; and (iii) cooling the bowed composite semiconductor component, wherein the layer of compound semiconductor material contracts more than the wafer of synthetic diamond material during cooling due to the thermal expansion mismatch &#x394;T, wherein B, t, t, and &#x394;Tare selected such that the layer of compound semiconductor material contracts on cooling by an amount which off-sets bowing in the bowed substrate thus pulling the bowed composite semiconductor component into a flat configuration, the layer of compound semiconductor material having a tensile stress after cooling of less than 500 MPa.

Substrates for semiconductor devices

A joint part () has a porous portion () that is defined by a multiplicity of solid regions where material is present and a remaining multiplicity of pore regions where material is absent, the locations of at least most of the multiplicity of solid regions being defined by one or more mathematical functions. The nature of the porous portion can be varied systematically by changing one or more constants in the mathematical functions and the part is made by a process of solid freeform fabrication.

Relating to joints and/or implants

Growing community of inventors

Bath, United Kingdom

Christopher Rhys Bowen